PMEG2005AELD NXP Semiconductors, PMEG2005AELD Datasheet - Page 10

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD882D leadless ultrasmall Surface-Mounted Device (SMD) plastic package with visible and solderable

PMEG2005AELD

Manufacturer Part Number
PMEG2005AELD
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD882D leadless ultrasmall Surface-Mounted Device (SMD) plastic package with visible and solderable
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
9. Package outline
10. Packing information
11. Soldering
PMEG2005AELD
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
PMEG2005AELD
Fig 16. Package outline SOD882D
Fig 17. Reflow soldering SOD882D
For further information and the availability of packing methods, see
Reflow soldering is the only recommended soldering method.
Packing methods
(2×)
0.8
All information provided in this document is subject to legal disclaimers.
Package
SOD882D 2 mm pitch, 8 mm tape and reel
Dimensions in mm
Rev. 1 — 10 May 2011
0.30
0.22
0.30
0.22
Description
1.4
0.2
0.3
0.4
1.3
1
0.65
0.55
0.55
0.45
2
1
20 V, 0.5 A low V
cathode marking on top side
0.65
(2×)
0.6
1.05
0.95
(2×)
0.7
PMEG2005AELD
F
MEGA Schottky barrier rectifier
Section
max
0.4
Dimensions in mm
[1]
10-08-06
14.
solder lands
solder resist
solder paste
sod882d_fr
© NXP B.V. 2011. All rights reserved.
Packing quantity
10000
-315
10 of 14

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