PMEG2005AELD NXP Semiconductors, PMEG2005AELD Datasheet - Page 8

• Manufacturer Part Number: PMEG2005AELD
• Description: Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD882D leadless ultrasmall Surface-Mounted Device (SMD) plastic package with visible and solderable
• Manufacturer: NXP Semiconductors

NXP Semiconductors
PMEG2005AELD
Product data sheet
Fig 10. Average forward current as a function of
Fig 12. Average forward current as a function of
I
I
F(AV)
F(AV)
(A)
(A)
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
0.75
0.50
0.25
0.00
0.75
0.50
0.25
0.00
0
FR4 PCB, standard footprint
T
ambient temperature; typical values
0
Ceramic PCB, Al
T
ambient temperature; typical values
j
j
= 150 °C
= 150 °C
(1)
(2)
(3)
(4)
25
(1)
(2)
(3)
(4)
25
50
50
2
O
75
75
3
, standard footprint
100
100
125
125
T
T
All information provided in this document is subject to legal disclaimers.
amb
amb
006aac565
006aac567
150
150
(°C)
(°C)
175
175
Rev. 1 — 10 May 2011
Fig 11. Average forward current as a function of
Fig 13. Average forward current as a function of
20 V, 0.5 A low V
I
I
F(AV)
F(AV)
(A)
(A)
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
0.75
0.50
0.25
0.00
0.75
0.50
0.25
0.00
0
0
FR4 PCB, mounting pad for cathode 1 cm
T
ambient temperature; typical values
T
solder point temperature; typical values
j
j
= 150 °C
= 150 °C
(1)
(2)
(3)
(4)
25
(1)
(2)
(3)
(4)
25
50
50
PMEG2005AELD
F
MEGA Schottky barrier rectifier
75
75
100
100
125
125
T
© NXP B.V. 2011. All rights reserved.
T
amb
sp
006aac566
006aac568
150
150
(°C)
(°C)
2
175
175
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