BAV70_SER NXP Semiconductors, BAV70_SER Datasheet - Page 11
BAV70_SER
Manufacturer Part Number
BAV70_SER
Description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)plastic packages
Manufacturer
NXP Semiconductors
Datasheet
1.BAV70_SER.pdf
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NXP Semiconductors
BAV70_SER_7
Product data sheet
Fig 15. Reflow soldering footprint BAV70S (SOT363/SC-88)
Fig 16. Wave soldering footprint BAV70S (SOT363/SC-88)
Dimensions in mm
solder lands
solder resist
occupied area
Dimensions in mm
4.50
solder lands
solder resist
occupied area
solder paste
Rev. 07 — 27 November 2007
2.35
transport direction during soldering
0.50
(4 )
0.50
(4 )
5.25
1.15
3.75
2.65
1.20
2.40
0.60
(2 )
High-speed switching diodes
BAV70 series
0.40
(2 )
0.90 2.10
0.30
© NXP B.V. 2007. All rights reserved.
sot363
1.00
sot363
4.00
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