STM8S207RB STMicroelectronics, STM8S207RB Datasheet - Page 101

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STM8S207RB

Manufacturer Part Number
STM8S207RB
Description
Performance line, 24 MHz STM8S 8-bit MCU, up to 128 Kbytes Flash, integrated EEPROM
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM8S207RB

Max Fcpu
up to 24 MHz, 0 wait states @ fCPU≤ 16 MHz
Program
up to 128 Kbytes Flash; data retention 20 years at 55 °C after 10 kcycles
Data
up to 2 Kbytes true data EEPROM; endurance 300 kcycles
Ram
up to 6 Kbytes
Advanced Control Timer
16-bit, 4 CAPCOM channels, 3 complementary outputs, dead-time insertion and flexible synchronization

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STM8S207xx, STM8S208xx
Table 58.
13-Apr-2010
10-Jul-2009
Date
Document revision history (continued)
Revision
cont’d
8
9
Section 10: Electrical
updated
operating
Section 10.3.1: VCAP external
replaced
updated
application with I2C bus and timing
Removed
Added link between ordering information
features
Document status changed from “preliminary data” to “datasheet”.
Table 2: STM8S20xxx performance line
STM8S207C8 is 16 (not 13).
Table 3: Peripheral clock gating bit assignments in CLK_PCKENR1/2
registers: updated bit positions for TIM2 and TIM3.
Figure 5: LQFP 48-pin
35 and 36; noted that these pins are available only in STM8S208xx
devices.
Figure 7: LQFP 32-pin
Table 6: Pin
availability and UART1_RX and UART3_RX pins.
Table 13: Option byte
bootloader option bytes to the option byte description table.
Added
Section 10.3: Operating
Table 18: General operating
and added data for ESR and ESL; removed “low power dissipation”
condition for T
Table 26: Total current consumption in halt mode at VDD = 5
replaced max value of I
condition “Flash in powerdown mode, HSI clock after wakeup”.
Table 33: HSI oscillator
calibrated values.
Functional EMS (electromagnetic susceptibility)
replaced “IEC 1000” with “IEC 61000”.
Electromagnetic interference (EMI)
J1752/3” with “IEC 61967-2”.
Table 57: Thermal
junction-ambient value of LQFP32 (7x7 mm) from 59 °C/W to 60
°C/W.
Doc ID 14733 Rev 12
Section 9: Unique ID
Table 15: Voltage characteristics
Figure 22
Table
Figure
conditions; updated VCAP specifications in
Table 56: Junction temperature range.
description: added footnotes concerning beCAN
A
2.
.
19; updated
characteristics: changed the thermal resistance
and
characteristics: Added data for TBD values;
description: added description of STM8L
pinout: added CAN_TX and CAN_RX to pins
pinout: replaced uart2 with uart3.
Figure
DD(H)
characteristics: updated the ACC
conditions: added introductory text.
conditions: replaced “C
(and listed this attribute in Features).
Table 35: RAM and hardware
at 85 °C from 30 µA to 35 µA for the
Changes
35; added
capacitor; updated
diagram.
and
Table
features: high sink I/O for
Figure 40: Typical
Figure 49
and
48: replaced “SAE
Table 18: General
and
Revision history
Figure
EXT
and STM8S20xx
Table
Table 18
” with “VCAP”
HSI
18;
registers;
47:
factory
V:
101/103
and in

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