PBSS302PD NXP Semiconductors, PBSS302PD Datasheet - Page 3

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PBSS302PD

Manufacturer Part Number
PBSS302PD
Description
40 V Pnp Low Vcesat Biss Transistor
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
PBSS302PD_2
Product data sheet
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
Symbol
T
T
T
Fig 1. Power derating curves
j
amb
stg
Device mounted on a ceramic PCB, Al
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
Operated under pulsed conditions: duty cycle
(1) Ceramic PCB, Al
(2) FR4 PCB, mounting pad for collector 6 cm
(3) FR4 PCB, mounting pad for collector 1 cm
(4) FR4 PCB, standard footprint
Limiting values
Parameter
junction temperature
ambient temperature
storage temperature
(mW)
Rev. 02 — 6 December 2007
P
1600
1200
2
tot
O
800
400
3
0
, standard footprint
…continued
75
25
2
(1)
(2)
(3)
(4)
O
Conditions
3
, standard footprint.
25
2
2
10 % and pulse width t
40 V, 4 A PNP low V
75
125
T
006aaa270
amb
( C)
Min
-
175
p
65
65
PBSS302PD
10 ms.
CEsat
© NXP B.V. 2007. All rights reserved.
Max
150
+150
+150
(BISS) transistor
Unit
C
C
C
2
2
.
.
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