MPC8358E Freescale Semiconductor, MPC8358E Datasheet - Page 19
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MPC8358E
Manufacturer Part Number
MPC8358E
Description
(MPC8358E / MPC8360E) PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8358E.pdf
(112 pages)
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6
This section describes the DC and AC electrical specifications for the DDR and DDR2 SDRAM interface
of the MPC8360E/58E.
6.1
Table 13
device when GV
Freescale Semiconductor
I/O supply voltage
I/O reference voltage
I/O termination voltage
Input high voltage
Input low voltage
MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2
DDR and DDR2 SDRAM
provides the recommended operating conditions for the DDR2 SDRAM component(s) of the
DDR and DDR2 SDRAM DC Electrical Characteristics
Parameter/Condition
RMII
GMII/RGMII/TBI/RTBI
SPI (master/slave)
UCC through TDM
MCC
UTOPIA L2
POS-PHY L2
HDLC Bus
HDLC/Transparent
UART/Async HDLC
BISYNC
USB
Note:
1. The QE needs to run at a frequency higher than or equal to what is listed in this table.
2. ‘F’ is the actual interface operating frequency.
3. The bit rate limit is independent of the data bus width (i.e. the same for serial, nibble, or octal
interfaces).
4. TDM in high-speed mode for serial data interface.
Table 13. DDR2 SDRAM DC Electrical Characteristics for GV
DD
Interface
(typ) = 1.8 V
Table 12. QE Operating Frequency Limitations (continued)
.
3.68 (max internal ref
Interface Operating
Frequency (MHz)
48 (ref clock)
125 (typ)
10 (max)
50 (max)
25 (max)
50 (max)
50 (max)
10 (max)
50 (max)
50 (typ)
2 (max)
clock)
Symbol
MV
GV
V
V
V
TT
REF
IH
IL
DD
Bit Rate (Mbps)
MV
Max interface
MV
0.49 × GV
115 (Kbps)
REF
REF
16.67
1000
1.71
–0.3
Min
100
800
800
10
70
10
50
12
2
+ 0.125
– 0.04
DD
Min QE Operating
Frequency
MV
MV
0.51 × GV
GV
8/3 × F
16 × F
REF
2 × F
8 × F
2 × F
REF
250
DD
50
20
20
20
20
96
Max
1.89
DD
– 0.125
+ 0.04
+ 0.3
1
(typ) = 1.8 V
(MHz)
DD
DDR and DDR2 SDRAM
Notes
2, 4
2, 3
Unit
2
2
2
V
V
V
V
V
Notes
1
2
3
19