MPC8358E Freescale Semiconductor, MPC8358E Datasheet - Page 99

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MPC8358E

Manufacturer Part Number
MPC8358E
Description
(MPC8358E / MPC8360E) PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
Manufacturer
Freescale Semiconductor
Datasheet

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Example:
23 Thermal
This section describes the thermal specifications of the MPC8360E/58E.
23.1
Table 77
Freescale Semiconductor
Index
MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2
A
B
4. Insert the chosen SPMF, COREPLL, CEPMF and CEPDF to the RCWL fields respectively.
Junction-to-ambient Natural Convection on single layer board (1s)
Junction-to-ambient Natural Convection on four layer board (2s2p)
Junction-to-ambient (@1 m/s) on single layer board (1s)
Junction-to-ambient (@ 1 m/s) on four layer board (2s2p)
Junction-to-ambient (@ 2 m/s) on single layer board (1s)
Junction-to-ambient (@ 2 m/s) on four layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Example A. To configure the device with CSB clock rate of 266 MHz, core rate of 400 MHz, and
QUICC Engine clock rate 300 MHz while the input clock rate is 33 MHz. Conf No. “s10” and “c1”
are selected from
CEPDF is “0.”
Example B. To configure the device with CSBCSB clock rate of 266 MHz, core rate of 533 MHz
and QUICC Engine clock rate 400 MHz while the input clock rate is 66 MHz. Conf No. “s5h” and
“c2h” are selected from
and CEPDF is “0.”
SPMF
1000
0100
provides the package thermal characteristics for the 740 37.5 mm x 37.5 mm TBGA package.
Thermal Characteristics
0000011
0000100
CORE
PLL
Table 77. Package Thermal Characteristics for the TBGA Package
CEPMF CEPDF
Table
01001
00110
Characteristic
76. SPMF is “1000,” CORPLL is “0000011,” CEPMF is “01001,” and
Table
0
0
76. SPMF is “0100,” CORPLL is “0000100,” CEPMF is “00110”
Input Clock
(MHz)
33
66
CSB Freq
(MHz)
266
266
Core Freq
(MHz)
400
533
Symbol
R
R
R
R
R
R
R
R
θJMA
θJMA
θJMA
θJMA
θJC
θJA
θJA
θJB
Engine Freq
QUICC
(MHz)
Value
300
400
4.5
1.1
15
11
10
8
9
7
(MHz)
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
400
(MHz)
533
Notes
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
4
5
Thermal
(MHz)
667
99

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