ST14C02C ST Microelectronics, ST14C02C Datasheet - Page 10
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ST14C02C
Manufacturer Part Number
ST14C02C
Description
Memory Card IC 2 Kbit 256 x 8 Serial I2C Bus EEPROM
Manufacturer
ST Microelectronics
Datasheet
1.ST14C02C.pdf
(12 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST14C02C
Manufacturer:
BOSCH
Quantity:
400
ST14C02C
Figure 10. AC Waveforms
ORDERING INFORMATION
Devices are shipped from the factory with the
memory content set at all ‘1’s (FFh).
The notation used for the device number is as
shown in Table 10. For a list of available options
(speed, package, etc...) or for further information
on any aspect of this device, please contact the ST
Sales Office nearest to you.
Sawn wafers are scribed and mounted in a frame
on adhesive tape. The orientation is defined by the
position of the GND pad on the die, viewed with
active area of product visible, relative to the notch-
10/12
SCL
SDA OUT
SCL
SDA IN
SCL
SDA IN
CONDITION
CONDITION
STOP
tCLQV
START
tCHDH
tCHDX
tCHCL
tDLCL
DATA OUTPUT
DATA VALID
tCLDX
INPUT
SDA
WRITE CYCLE
tW
CHANGE
SDA
es of the frame (as shown in Figure 11). The orien-
tation of the die with respect to the plastic frame
notches is specified by the Customer.
One further concern, when specifying devices to
be delivered in this form, is that wafers mounted
on adhesive tape must be used within a limited pe-
riod from the mounting date:
– two months, if wafers are stored at 25°C, 55%
– six months, if wafers are stored at 4°C, 55% rel-
tCLQX
relative humidity
ative humidity
tCLCH
tDXCX
tCHDX
CONDITION
BUS FREE
START
STOP &
tCHDH
AI00795B
tDHDL