tea1094t NXP Semiconductors, tea1094t Datasheet - Page 21

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tea1094t

Manufacturer Part Number
tea1094t
Description
Hands Free Ic
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
PACKAGE OUTLINES
1996 Jul 15
DIP28: plastic dual in-line package; 28 leads (600 mil)
handbook, full pagewidth
Hands free IC
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Note
inches
UNIT
mm
VERSION
SOT117-1
OUTLINE
L
Z
max.
0.20
28
5.1
1
A
pin 1 index
0.020
min.
0.51
A
1
051G05
IEC
max.
0.16
4.0
A
2
0.066
0.051
1.7
1.3
b
e
MO-015AH
D
0.020
0.014
0.53
0.38
JEDEC
b
1
REFERENCES
0.013
0.009
0.32
0.23
c
0
b
36.0
35.0
1.41
1.34
D
(1)
scale
EIAJ
21
5
14.1
13.7
0.56
0.54
E
(1)
15
14
b
1
10 mm
2.54
0.10
e
A
1
w
E
M
A
15.24
2
0.60
e
1
A
0.15
0.13
3.9
3.4
L
TEA1094; TEA1094A
PROJECTION
EUROPEAN
15.80
15.24
c
0.62
0.60
M
E
17.15
15.90
0.68
0.63
M
(e )
M
Product specification
M
H
1
H
E
ISSUE DATE
0.25
0.01
92-11-17
95-01-14
w
SOT117-1
max.
0.067
1.7
Z
(1)

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