se97pw/1 NXP Semiconductors, se97pw/1 Datasheet - Page 19
se97pw/1
Manufacturer Part Number
se97pw/1
Description
Se97 Memory Module Temp Sensor With Integrated Spd
Manufacturer
NXP Semiconductors
Datasheet
1.SE97PW1.pdf
(43 pages)
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NXP Semiconductors
Table 8.
[1]
SE97_2
Product data sheet
Bit
Symbol
Default
Access
Bit
Symbol
Default
Access
SE97PW, SE97TK = 1; SE97PW/1, SE97TK/1 = 0.
Capability Register (address 00h) bit allocation
8.2 Capability Register (00h, 16-bit read-only)
15
R
0
R
7
0
Table 9.
Bit
15:5
4:3
2
1
0
RFU
14
R
0
R
6
0
Symbol
RFU
TRES
WRNG
HACC
BCAP
Capability Register (address 00h) bit description
13
R
0
R
5
0
Rev. 02 — 12 October 2007
Description
Reserved for future use; must be zero.
Temperature resolution.
Wider range.
Higher accuracy bit set during manufacture.
Basic capability.
10 — 0.125 C LSB
1 — can read temperatures below 0 C and set sign bit accordingly
0 — accuracy 2 C over the active range and 3 C over the
monitor range (C-grade)
1 — high accuracy 1 C over the active range and 2 C over the
monitor range (B-grade)
1 — has Alarm and Critical Trips capability
12
R
0
R
4
1
Memory module temp sensor with integrated SPD
TRES
RFU
11
R
0
R
3
0
WRNG
10
R
0
R
2
1
HACC
R
9
0
[1]
R
1
© NXP B.V. 2007. All rights reserved.
SE97
BCAP
R
8
0
R
0
1
19 of 43
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