se97pw/1 NXP Semiconductors, se97pw/1 Datasheet - Page 36

• Manufacturer Part Number: se97pw/1
• Description: Se97 Memory Module Temp Sensor With Integrated Spd
• Manufacturer: NXP Semiconductors

NXP Semiconductors
12. Package outline
Fig 37. Package outline SOT530-1 (TSSOP8)
SE97_2
Product data sheet
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT530-1
max.
1.1
A
0.15
0.05
A 1
1
0.95
0.85
8
A 2
y
IEC
e
pin 1 index
Z
0.25
A 3
D
0.30
0.19
b p
b p
5
4
MO-153
0
0.20
0.13
JEDEC
c
w
REFERENCES
M
D
3.1
2.9
Rev. 02 — 12 October 2007
(1)
c
E
4.5
4.3
(2)
JEITA
scale
A 2
0.65
2.5
e
A 1
Memory module temp sensor with integrated SPD
H E
6.5
6.3
0.94
L
H E
E
detail X
0.7
0.5
L p
5 mm
L
0.1
v
L p
PROJECTION
EUROPEAN
0.1
w
(A 3 )
A
0.1
y
A
0.70
0.35
X
Z
© NXP B.V. 2007. All rights reserved.
(1)
v
ISSUE DATE
M
00-02-24
03-02-18
A
8
0
SOT530-1
SE97
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