se97pw/1 NXP Semiconductors, se97pw/1 Datasheet - Page 40

• Manufacturer Part Number: se97pw/1
• Description: Se97 Memory Module Temp Sensor With Integrated Spd
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Abbreviations
SE97_2
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 32.
Acronym
ADC
ARA
CDM
CPU
DDR
DIMM
DRAM
EEPROM
ESD
HBM
I
LSB
MM
MSB
PC
PCB
POR
2
Fig 39. Temperature profiles for large and small components
C-bus
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
A-to-D Converter
Alert Response Address
Charged Device Model
Central Processing Unit
Double Data Rate
Dual In-line Memory Module
Dynamic Random Access Memory
Electrically Erasable Programmable Read-Only Memory
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Least Significant Bit
Machine Model
Most Significant Bit
Personal Computer
Printed-Circuit Board
Power-On Reset
Rev. 02 — 12 October 2007
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Memory module temp sensor with integrated SPD
temperature
peak
© NXP B.V. 2007. All rights reserved.
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SE97
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