lis3dsh STMicroelectronics, lis3dsh Datasheet - Page 19

• Manufacturer Part Number: lis3dsh
• Description: Mems Digital Output Motion Sensor Ultra Low-power High Performance Three-axis “nano” Accelerometer
• Manufacturer: STMicroelectronics

LIS3DSH
4
4.1
Application hints
Figure 5.
The device core is supplied through the Vdd line while the I/O pins are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF) should be placed
as near as possible to pin 14 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I
Soldering information
The LGA package is compliant with the ECOPACK
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
LIS3DSH electrical connection
Vdd
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
100nF
GND
10µF
2
C or SPI interfaces. When using the I
Figure
Vdd_IO
Doc ID 022405 Rev 1
5). It is possible to remove Vdd maintaining Vdd_IO
NC
NC
1
5
5
16
6
TOP VIEW
®
, RoHS and “Green” standard.
14
8
13
9
9
2
INT1/DRDY
C, CS must be tied high.
INT 2
Application hints
AM10211V1
19/53