lis3dsh STMicroelectronics, lis3dsh Datasheet - Page 51

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lis3dsh

Manufacturer Part Number
lis3dsh
Description
Mems Digital Output Motion Sensor Ultra Low-power High Performance Three-axis “nano” Accelerometer
Manufacturer
STMicroelectronics
Datasheet

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LIS3DSH
9
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 12. LGA-16: mechanical data and package dimensions
R ef .
A1
A2
A3
D1
E1
N1
N2
P1
P2
T1
T2
L1
L2
M
d
k
®
2.850 3.000 3.150 0.1122 0.1181 0.1240
2.850 3.000 3.150 0.1122 0.1181 0.1240
0.040 0.100 0.160 0.0016 0.0039 0.0063
0.290 0.350 0.410 0.0114 0.0138 0.0161
0.190 0.250 0.310 0.0075 0.0098 0.0122
packages, depending on their level of environmental compliance. ECOPACK
M i n. Typ. M ax. M i n. Typ. M ax.
0.785
0.200
1.000 1.060
2.000 2.060
0.500
1.000
0.875
1.275
0.150
0.050
m m
D i m ensi ons
1.000
Doc ID 022405 Rev 1
0.0309
0.0079
0.0394 0.0417
0.0787 0.0811
0.0197
0.0394
0.0344
0.0502
0.0059
0.0020
i nch
0.0394
Land Grid Array Package
LGA-16 (3x3x1.0mm)
m echani cal dat a
O ut l i ne and
Package information
7983231
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