DAC1408D650HW/C1 NXP [NXP Semiconductors], DAC1408D650HW/C1 Datasheet - Page 2

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DAC1408D650HW/C1

Manufacturer Part Number
DAC1408D650HW/C1
Description
Manufacturer
NXP [NXP Semiconductors]
Datasheet
NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
DAC1408D650_1
Objective data sheet
Type number
DAC1408D650HW/C1
Ordering information
I
I
I
I
I
I
I
I
I
I
Package
Name
HTQFP100
32-bit programmable NCO frequency
Low power NCO option
LVDS compatible clock inputs
Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA
Communication: LMDS/MMDS, point to point
Direct Digital Synthesis (DDS)
Broadband wireless systems
Digital radio links
Instrumentation
Automated Test Equipment (ATE)
Description
plastic thermal enhanced thin quad flat package; 100 leads;
body 14
Rev. 01 — 26 May 2009
14
Dual 14-bit DAC, up to 650 Msps, 2 and 4 interpolating
1 mm; exposed die pad
I
I
I
Industrial temperature range from
Typical power dissipation: 1.19 W
Power down and Sleep modes
40 C to +85 C
DAC1408D650
© NXP B.V. 2009. All rights reserved.
Version
SOT638-1
2 of 88

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