SE98 NXP [NXP Semiconductors], SE98 Datasheet - Page 16

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SE98

Manufacturer Part Number
SE98
Description
DDR memory module temp sensor, 3.3 V
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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NXP Semiconductors
Table 6.
SE98_4
Product data sheet
Bit
Symbol
Reset
Access
Bit
Symbol
Reset
Access
Capability register (address 00h) bit allocation
8.2 Capability register (00h, 16-bit read-only)
15
R
0
R
7
0
Table 7.
Bit
15:5
4:3
2
1
0
RFU[2:0]
14
R
0
R
6
0
Symbol
RFU
TRES
WRNG
HACC
BCAP
Capability register (address 00h) bit description
13
R
0
R
5
0
Rev. 04 — 2 February 2009
Description
Reserved for future use. Must be zero.
Temperature resolution.
Wider range.
Higher accuracy (set during manufacture).
Basic capability.
10 — 0.125 C LSB (11-bit)
1 — can read temperatures below 0 C and set sign bit accordingly
0 — C grade accuracy
1 — has Alarm and Critical Trips interrupt capability.
12
R
0
R
4
1
RFU[10:3]
TRES[1:0]
11
R
0
R
3
0
DDR memory module temp sensor, 3.3 V
WRNG
10
R
0
R
2
1
HACC
R
9
0
R
1
0
© NXP B.V. 2009. All rights reserved.
SE98
BCAP
R
8
0
R
0
1
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