SE98 NXP [NXP Semiconductors], SE98 Datasheet - Page 34

• Manufacturer Part Number: SE98
• Description: DDR memory module temp sensor, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
14. Abbreviations
SE98_4
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 30.
Acronym
ADC
ARA
CDM
CMOS
DIMM
DRAM
HBM
I
LSB
MM
MSB
SO-DIMM
POR
SMBus
SPD
2
Fig 22. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Analog-to-Digital Converter
Alert Response Address
Charged Device Model
Complementary Metal-Oxide Semiconductor
Dual In-line Memory Module
Dynamic Random Access Memory
Human Body Model
Inter Integrated Circuit bus
Least Significant Bit
Machine Model
Most Significant Bit
Small Outline Dual In-line Memory Module
Power-On Reset
System Management Bus
Serial Presence Detect
Rev. 04 — 2 February 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
DDR memory module temp sensor, 3.3 V
temperature
peak
© NXP B.V. 2009. All rights reserved.
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