HYS64D16000 Infineon, HYS64D16000 Datasheet
HYS64D16000
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HYS64D16000 Summary of contents
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... – 6 – C 200 Small Outli ne Dual -In- Line Memor y Modules ...
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... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...
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... – 6 – C 200 Small Outli ne Dual -In- Line Memor y Modules ...
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... Subjects (major changes since last revision) We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: techdoc.mp@infineon.com 2003-08 2003-03 Template: mp_a4_v2.0_2003-06-06.fm ...
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... Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.2 Current Specification and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.3 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4 SPD Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules 5 Rev. 0.5, 2003-08 ...
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... Small Outline Dual-In-Line Memory Modules SO-DIMM 1 Overview 1.1 Features • Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules • One rank 16M 64 and two ranks 32M 64 organization • JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM) • Single +2 0.2 V) power supply • ...
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... Table 1 Ordering Information Type PC2700 (CL=2.5) HYS64D16000HDL–6–C HYS64D32020HDL–6–C Notes 1. All part numbers end with a place code designating the silicon-die revision. Reference information available on request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components. 2. The Compliance Code is printed on the module labels describing the speed sort (for example “PC2700”), the latencies and SPD code definition (for example “ ...
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... SA0 - SA2 Input; O: Output; I/O: bidirectional In-/Output; AI: Analog Input; PWR: Power Supply; GND: Signal Ground; NC: Not Connected; NU: Not Usable 2) CKE1 and S1 are used on two bank modules only Data Sheet 1) Function Address Inputs Bank Address Data Input/Output Command Input Clock Enable ...
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... SS 53 DQ19 54 DQ23 55 DQ24 56 DQ28 DQ25 60 DQ29 61 DQS3 62 DM3 Data Sheet Small Outline DDR SDRAM Modules Front side Back side Pin # Symbol Pin # Symbol 65 DQ26 66 DQ30 67 DQ27 68 DQ31 (CB0) 72 (CB4) 73 (CB1) 74 (CB5) V ...
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... Table 4 Density Organization Memory Ranks 128MB 16M 64 1 256MB 32M 64 2 Figure 1 Pin Configuration Data Sheet Small Outline DDR SDRAM Modules SDRAMs # row/bank/ SDRAMs columns bits 16M 16 4 13/2/9 16M 16 8 13/2/9 front side back side 10 HYS64D[32020/16000]HDL–6–C Pin Configuration Refresh ...
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... SDRAMS D0-D3 SCL SDRAMS D0-D3 SA0 SDRAMS D0-D3 SA1 SDRAMS D0-D3 SA2 SDRAMS D0-D3 N.C. SPD SDRAMS D0-D3 SDRAMS D0-D3 V and SDRAMS D0-D3, SPD 64 DDR SDRAM SO-DIMM HYS64D16000HDL–6–C 11 HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules Pin Configuration s LDQS LDM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDM I/O 8 ...
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... CK 1 Note: DQ wiring may differ from that described in this drawing; however DQ/DM/DQS relationships are maintained as shown and DDR SDRAM SO-DIMM HYS64D32020HDL-6-C 12 HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules Pin Configuration S LDQS LDM I/O 0 I/O 1 I/O 2 I I/O 5 I/O 6 I/O 7 ...
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... DDQ DDQ V – 0.04 V REF V + 0.15 V REF V –0.3 –0.3 V 0.36 V 0.71 1.4 13 HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules Electrical Characteristics Values Unit Note/ Test typ. max. – DDQ 0.5 – +3.6 V – +3.6 V – +3.6 V – +70 C – +150 C 1 – – ...
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... REF V stabilizes. REF 14 HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules Electrical Characteristics Unit Note/Test Condition A Any input 0 V All other pins not under test 6) DQs are disabled; ...
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... for DDR266(A for DDR333 and DDR400B Auto-Refresh Current burst refresh RC RFCMIN Self-Refresh Current CKE 0.2 V; external clock on Operating Current 7 four bank interleaving with Burst Length = 4; see component data sheet. Data Sheet Small Outline DDR SDRAM Modules V IL,MAX V ; IH,MIN for DQ, DQS and DM; ...
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... DDx DD3N modules I currents are not included in the calculations (see note 1) DDQ 5) The module I values are calculated from the corrponent DDx Data Sheet HYS64D16000HDL–6–C HYS64D32020HDL–6–C 128MB 256MB 64 1 Rank 2 Ranks –6 –6 typ. max. typ. 260 ...
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... Address and control input setup time Address and control input hold time Read preamble Read postamble Active to Precharge command Active to Active/Auto-refresh command period Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules Electrical Characteristics Symbol –6 DDR333 Min. Max. t –0.7 +0 ...
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... V/ns , slow slew rate ns, measured between V and OH(ac) 11) For each of the terms, if not already an integer, round to the next highest integer. cycle time. 12) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device. Data Sheet Small Outline DDR SDRAM Modules Symbol t RFC t RCD ...
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... Module Density per Rank 32 tAS, tCS [ns] 33 tAH, TCH [ns] 34 tDS [ns] Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules HYS64D16000HDL–6–C HYS64D32020HDL–6–C 128MB 256MB Rank 2 Ranks –6 –6 HEX HEX 80 80 ...
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... Part Number, Char 13 86 Part Number, Char 14 87 Part Number, Char 15 88 Part Number, Char 16 89 Part Number, Char 17 Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules HYS64D16000HDL–6–C HYS64D32020HDL–6–C 128MB 256MB Rank 2 Ranks –6 –6 HEX HEX ...
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... Module Revision Code 92 Test Program Revision Code 93 Module Manufacturing Date Year Module Manufacturing Date Week 99 - 127 not used Data Sheet HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules HYS64D16000HDL–6–C HYS64D32020HDL–6–C 128MB 256MB Rank 2 Ranks –6 –6 HEX ...
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... Package Outlines (2.15) 1 18.45 1.8 (2.4) 11.4 ±0.1 (2.7) (2.45) 1.5 1 ±0.1 101 2 MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 4 Package Outlines – Raw Card C DDR-SDRAM SO-DIMM HYS64D16000HDL-6-C Data Sheet 67.6 63.6 (2.45) ±0.1 ±0.1 47.4 ±0.1 (2.15) ±0.1 200 0.45 ±0.03 22 HYS64D[32020/16000]HDL–6–C Small Outline DDR SDRAM Modules Package Outlines 2.4 MAX. 100 1 ± ...
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... MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 5 Package Outlines – Raw Card A DDR SDRAM SO-DIMM HYS64D32020HDL-6-C Data Sheet Small Outline DDR SDRAM Modules 67.6 63.6 ±0.1 (2.45) 100 ±0.1 47.4 ±0.1 (2.15) 200 0.45 ±0.03 23 HYS64D[32020/16000]HDL–6–C Package Outlines 3.8 MAX. 1 ± ...
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... Published by Infineon Technologies AG ...