EVAL-ADE7816EBZ AD [Analog Devices], EVAL-ADE7816EBZ Datasheet - Page 8
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EVAL-ADE7816EBZ
Manufacturer Part Number
EVAL-ADE7816EBZ
Description
Six Current Channels, One Voltage Channel
Manufacturer
AD [Analog Devices]
Datasheet
1.EVAL-ADE7816EBZ.pdf
(48 pages)
- Current page: 8 of 48
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ADE7816
ABSOLUTE MAXIMUM RATINGS
T
Table 5.
Parameter
VDD to AGND
VDD to DGND
Analog Input Voltage to AGND, IAP, IAN,
Analog Input Voltage to VP and VN
Reference Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to DGND
Operating Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
A
IBP, IBN, ICP, ICN, IDP, IEP, IFP, IN
Industrial Range
Storage Temperature Range
Junction Temperature
= 25°C, unless otherwise noted.
Rating
−0.3 V to +3.7 V
−0.3 V to +3.7 V
−40°C to +85°C
−2 V to +2 V
−2 V to +2 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−65°C to +150°C
150°C
Rev. 0 | Page 8 of 48
Regarding the temperature profile used in soldering RoHS-
compliant parts, Analog Devices, Inc., advises that reflow profiles
should conform to J-STD-20 from JEDEC. Refer to the JEDEC
website for the latest revision.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
40-Lead LFCSP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
29.3
JA
θ
1.8
JC
Data Sheet
Unit
°C/W
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