AM29PDL310G73WHIN SPANSION [SPANSION], AM29PDL310G73WHIN Datasheet - Page 57

• Manufacturer Part Number: AM29PDL310G73WHIN
• Description: 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control
• Manufacturer: SPANSION [SPANSION]

PHYSICAL DIMENSIONS
FBE080—80-Ball Fine-pitch Ball Grid Array 12 x 11 mm package
56
PACKAGE
SYMBOL
SD / SE
JEDEC
A
E1
MD
ME
D1
A1
A2
b
D
N
A
E
e
A1
A1 CORNER INDEX MARK
10.95 mm x 11.95 mm
0.20
0.84
0.25
MIN.
---
PACKAGE
11.95 BSC.
10.95 BSC.
FBE 080
A3-A6, B3-B6,
L3-L6, M3-M6
8.80 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
NOM.
0.30
N/A
12
80
---
---
---
8
E
MAX.
1.20
0.94
0.35
SIDE VIEW
TOP VIEW
---
D
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
DEPOPULATED SOLDER BALLS
10
SOLDER BALL PLACEMENT
SEATING PLANE
PACKAGE OUTLINE TYPE
OVERALL THICKNESS
TOTAL BALL COUNT
BODY THICKNESS
BALL FOOTPRINT
BALL FOOTPRINT
BALL DIAMETER
BALL HEIGHT
BALL PITCH
BODY SIZE
BODY SIZE
NOTE
P R E L I M I N A R Y
A2
0.20 (4X)
A
Am29PDL640G
E
B
Z
0.25
0.08
eE
Z
Z
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, INK MARK,
eD
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE
IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER
BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM Z.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" IN THE PACKAGE DRAWING INDICATES THE THEORETICAL
CENTER OF DEPOPULATED BALLS.
FOR PACKAGE THICKNESS, "A" IS THE CONTROLLING DIMENSION.
METALLIZED MARKINGS INDENTION OR OTHER MEANS.
6
e REPRESENTS THE SOLDER BALL GRID PITCH.
NXOb
M
φ0.08
φ0.15
L
K
M
M
J
Z
Z A B
H
G
BOTTOM VIEW
D1
F
SD
E
D
7
C
B
A
8
7
6
5
4
3
2
1
February 26, 2003
SE
A1 CORNER
7
E1
3150\38.9G