MT48LC2M32B2TG-6 :G Micron, MT48LC2M32B2TG-6 :G Datasheet - Page 69
![no-image](/images/no-image-200.jpg)
MT48LC2M32B2TG-6 :G
Manufacturer Part Number
MT48LC2M32B2TG-6 :G
Description
DRAM Chip SDRAM 64M-Bit 3.3V 86-Pin TSOP-II
Manufacturer
Micron
Datasheet
1.MT48LC2M32B2B5-7G.pdf
(69 pages)
- Current page: 69 of 69
- Download datasheet (3Mb)
Figure 51:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
90X Ø0.45 ±0.05
SEATING PLANE
11.20 ±0.10
0.10 C
90-Ball VFBGA (8mm x 13mm)
BALL A9
5.60 ±0.05
Notes:
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
C
0.65 ±0.05
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. Recommended pad size for PCB is 0.33mm ±0.025mm.
4. Topside part marking decoder can be found at:
www.micron.com/productsupport Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
3.20 ±0.05
0.025mm per side.
tools/fbga/decoder.
All other trademarks are the property of their respective owners.
8.00 ±0.10
6.40
C L
4.00 ±0.05
0.80 TYP
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
69
13.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
www.micron.com/support/designsupport/
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø0.40
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
BALL A1 ID
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