S34ML02G100BHI000 Spansion, S34ML02G100BHI000 Datasheet - Page 66
S34ML02G100BHI000
Manufacturer Part Number
S34ML02G100BHI000
Description
Flash 2Gb 3V 25ns NAND Flash
Manufacturer
Spansion
Datasheet
1.S34ML04G100BHI000.pdf
(76 pages)
Specifications of S34ML02G100BHI000
Rohs
yes
Memory Type
NAND Flash
Memory Size
2 Gbit
Timing Type
Asynchronous
Access Time
20 ns
Supply Voltage - Max
3.6 V
Supply Voltage - Min
2.7 V
Operating Temperature
- 40 C to + 85 C
Mounting Style
SMD/SMT
Package / Case
BGA-63
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S34ML02G100BHI000
Manufacturer:
ST
Quantity:
101
Part Number:
S34ML02G100BHI000
Manufacturer:
SPANSIO
Quantity:
20 000
66
7.1.2
63-Pin Ball Grid Array (BGA)
SYMBOL
PACKAGE
JEDEC
D X E
MD
ME
D1
Øb
eD
SD
SE
A1
E1
eE
A
D
E
n
Spansion
MIN
0.25
0.40
---
A3-A8,B2-B8,C1,C2,C9,C10
D1,D2,D9,D10,E1,E2,E9,E10
F1,F2,F9,F10,G1,G2,G9,G10
H1,H2,H9,H10,J1,J2,J9,J10
K1,K2,K9,K10,L3-L8,M3-M8
11.00 mm x 9.00 mm
M0-207(M)
PACKAGE
11.00 BSC
9.00 BSC
8.80 BSC
7.20 BSC
0.80 BSC
0.80 BSC
0.40 BSC
0.40 BSC
VBM 063
®
NOM
0.45
Figure 7.2 VBM063 — 63-Pin BGA, 11 mm x 9 mm Package
12
10
63
---
---
SLC NAND Flash Memory for Embedded
MAX
1.00
0.50
---
PROFILE
BALL HEIGHT
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
D a t a
NOTE
S h e e t
NOTES:
8.
9
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP 95, SECTION 4.3,
4.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
6
7
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
SPP-010.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S34ML01G1_04G1_15 March 7, 2013
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