PCAL9555APW,118 NXP Semiconductors, PCAL9555APW,118 Datasheet - Page 39

• Manufacturer Part Number: PCAL9555APW,118
• Description: Interface - I/O Expanders 16b I2C BUS INTERUPT
• Manufacturer: NXP Semiconductors

Specifications of PCAL9555APW,118

• Rohs: yes
• Maximum Operating Frequency: 100 kHz
• Operating Supply Voltage: 1.65 V to 5.5 V
• Operating Temperature Range: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-24
• Operating Current: 160 mA
• Output Current: 25 mA
• Power Dissipation: 200 mW
• Product Type: I/O Expanders
• Factory Pack Quantity: 2500

NXP Semiconductors
PCAL9555A
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 35.
Table 36.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
< 2.5
 2.5
•
•
•
•
•
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 35
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
36
Low-voltage 16-bit GPIO with Agile I/O, interrupt and weak pull-up
34.
Rev. 1 — 3 October 2012
Package reflow temperature (C)
Volume (mm
< 350
235
220
Package reflow temperature (C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
34) than a SnPb process, thus
 350
220
220
PCAL9555A
245
> 2000
260
245
© NXP B.V. 2012. All rights reserved.
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