C8051F989-GUR Silicon Labs, C8051F989-GUR Datasheet - Page 43

• Manufacturer Part Number: C8051F989-GUR
• Description: 8-bit Microcontrollers - MCU 4kB 512B RAM
• Manufacturer: Silicon Labs

Specifications of C8051F989-GUR

• Rohs: yes
• Core: 8051
• Data Bus Width: 8 bit
• Processor Series: C8051

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all
4. A 2x2 array of 1.10 mm x 1.10 mm openings on 1.30 mm pitch should be
1. A No-Clean, Type-3 solder paste is recommended.
1. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
between the solder mask and the metal pad is to be 60 µm minimum, all
the way around the pad.
walls should be used to assure good solder paste release.
perimeter pads.
used for the center ground pad.
specification for Small Body Components.
Dimension
C1
C2
X1
X2
Y1
Y2
E
Table 3.5. PCB Land Pattern
Rev. 1.1
3.90
3.90
0.20
2.70
0.65
2.70
MIN
C8051F99x-C8051F98x
0.50 BSC
MAX
4.00
4.00
0.30
2.80
0.75
2.80
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