NDS8435A_Q Fairchild Semiconductor, NDS8435A_Q Datasheet

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NDS8435A_Q

Manufacturer Part Number
NDS8435A_Q
Description
MOSFET Single P-Ch FET Enhancement Mode
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of NDS8435A_Q

Product Category
MOSFET
Transistor Polarity
P-Channel
Drain-source Breakdown Voltage
- 30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
- 7.9 A
Resistance Drain-source Rds (on)
0.02 Ohms
Configuration
Single Quad Drain Triple Source
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOIC-8 Narrow
Fall Time
46 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
2.5 W
Rise Time
20 ns
Typical Turn-off Delay Time
95 ns
Absolute Maximum Ratings
© 1997 Fairchild Semiconductor Corporation
___________________________________________________________________________________________
Symbol
V
V
I
P
T
THERMAL CHARACTERISTICS
R
R
NDS8435A
General Description
SO-8 P-Channel enhancement mode power field effect
transistors are produced using Fairchild's proprietary, high cell
density, DMOS technology. This very high density process is
especially tailored to minimize on-state resistance and provide
superior switching performance. These devices are particularly
suited for low voltage applications such as notebook computer
power management and other battery powered circuits where
fast switching, low in-line power loss, and resistance to
transients are needed.
D
Single P-Channel Enhancement Mode Field Effect Transistor
DSS
GSS
D
J
,T
JA
JC
STG
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current - Continuous
Maximum Power Dissipation
Operating and Storage Temperature Range
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
- Pulsed
T
A
= 25°C unless otherwise noted
(Note 1a)
(
(Note 1a)
(Note 1b)
(Note 1c)
Note 1a)
(Note 1)
Features
-7.9 A, -30 V. R
High density cell design for extremely low R
High power and current handling capability in a widely used
surface mount package.
5
6
7
8
R
NDS8435A
DS(ON)
DS(ON)
-55 to 150
-7.9
±20
-30
-25
2.5
1.2
50
25
1
= 0.035
= 0.023
@ V
@ V
4
2
3
1
GS
GS
= -4.5V.
= -10 V
DS(ON).
March 1997
NDS8435A Rev.C
Units
°C/W
°C/W
°C
W
V
V
A
1

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NDS8435A_Q Summary of contents

Page 1

... Operating and Storage Temperature Range J STG THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case JC © 1997 Fairchild Semiconductor Corporation Features -7 High density cell design for extremely low R High power and current handling capability in a widely used surface mount package 25° ...

Page 2

Electrical Characteristics (T = 25°C unless otherwise noted) A Symbol Parameter OFF CHARACTERISTICS BV Drain-Source Breakdown Voltage DSS Zero Gate Voltage Drain Current I DSS I Gate - Body Leakage, Forward GSSF Gate - Body Leakage, Reverse I GSSR ON ...

Page 3

Electrical Characteristics (T = 25°C unless otherwise noted) A Symbol Parameter DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS I Maximum Continuous Drain-Source Diode Forward Current S V Drain-Source Diode Forward Voltage SD Notes the sum of the junction-to-case ...

Page 4

Typical Electrical Characteristics -30 -4.5 V =-10V GS -4.0 -6.0 -24 -3.5 -18 -3.0 - -0 DRAIN-SOURCE VOLTAGE (V) DS Figure 1. On-Region Characteristics 1 -7. -10V ...

Page 5

Typical Electrical Characteristics 1.125 I = -250µA 1.1 D 1.075 1.05 1.025 1 0.975 0.95 0.925 -50 - JUNCTION TEMPERATURE (°C) J Figure 7. Breakdown Voltage Variation with Temperature ...

Page 6

Typical Electrical and ThermalCharacteristics 10V -12 - DRAIN CURRENT (A) D Figure 13. Transconductance Variation with Drain . Current and Temperature 8.5 8 7.5 7 6.5 ...

Page 7

... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ACEx™ CoolFET™ CROSSVOLT™ CMOS FACT™ FACT Quiet Series™ ® FAST FASTr™ ...

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