MD4832-D512-V3Q18-X-P/Y SanDisk, MD4832-D512-V3Q18-X-P/Y Datasheet - Page 29

• Manufacturer Part Number: MD4832-D512-V3Q18-X-P/Y
• Description: IC MDOC G3 512MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD4832-D512-V3Q18-X-P/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 512M (64M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 585-1139

2.5
2.5.1 Ball Diagram
See Figure 9 for the Mobile DiskOnChip G3 1Gb (dual-die) ball diagram. To ensure proper device
functionality, balls marked RSRVD are reserved for future use and should not be connected.
Note: Mobile DiskOnChip G3 1Gb is designed as a drop-in replacement for Mobile DiskOnChip
9x12 FBGA Package
26
G3 512Mb, assuming that the board was designed according to the migration guide
guidelines. Refer to application note AP-DOC-067, Preparing your PCB Footprint for the
DiskOnChip BGA Migration Path, for further information.
1Gb Multiplexed Interface
Figure 9: Ballout for Multiplexed Interface (Mobile DiskOnChip G3 1Gb 9x12 FBGA Package)
M
A
B
C
D
G
H
K
E
F
J
L
1
M
M
M
M
M
M
A
RSRVD
VSS
VSS
VSS
DPD
CE#
2
VSS
VSS
VSS
VSS
VSS
OE#
AD0
AD8
3
RSRVD
RSRVD
RSRVD
Preliminary Data Sheet, Rev. 1.1
VCCQ
AD10
AD1
AD9
AD2
4
RSRVD
RSTIN#
BUSY#
AD11
VCC
AD3
5
RSRVD
RSRVD
VCCQ
WE#
AD4
CLK
6
RSRVD
AD13
AD12
VSS
VSS
VSS
AD6
AD5
7
DMARQ#
ID0(VSS)
LOCK#
AD15
AD14
VSS
VSS
AD7
8
RSRVD
RSRVD
RSRVD
AVD#
IRQ#
VSS
9
Mobile DiskOnChip G3
10
M
M
M
M
M
M
91-SR-011-05-8L