MD4832-D512-V3Q18-X-P/Y SanDisk, MD4832-D512-V3Q18-X-P/Y Datasheet - Page 33

• Manufacturer Part Number: MD4832-D512-V3Q18-X-P/Y
• Description: IC MDOC G3 512MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD4832-D512-V3Q18-X-P/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 512M (64M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 585-1139

3.
3.1
Mobile DiskOnChip G3 consists of the following major functional blocks, as shown in Figure 11.
These components are described briefly below and in more detail in the following sections.
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*ADDR[0] and DPD are multiplexed on the same ball/pin.
System Interface for the host interface.
Configuration Interface for configuring Mobile DiskOnChip G3 to operate in 8-bit,
16-bit or 32-bit mode, cascaded configuration, hardware read/write protection and
entering/exiting Deep Power-Down mode.
Read/Write Protection and OTP for advanced data/code security and protection.
Programmable Boot Block with XIP functionality enhanced with a Download
Engine (DE) for system initialization capability.
Error Detection and Error Correction Code (EDC/ECC) for on-the-fly
error handling.
Data Pipeline through which the data flows from the system to the NAND flash arrays.
Control & Status block that contains registers responsible for transferring the address,
data and control information between the TrueFFS driver and the flash
T
Overview
HEORY OF
Figure 11: Mobile DiskOnChip G3 Simplified Block Diagram, Standard Interface
O
PERATION
Preliminary Data Sheet, Rev. 1.1
media.
Mobile DiskOnChip G3
91-SR-011-05-8L