MD4832-D512-V3Q18-X-P/Y SanDisk, MD4832-D512-V3Q18-X-P/Y Datasheet - Page 76

• Manufacturer Part Number: MD4832-D512-V3Q18-X-P/Y
• Description: IC MDOC G3 512MB 85-FBGA
• Manufacturer: SanDisk

Specifications of MD4832-D512-V3Q18-X-P/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 512M (64M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 585-1139

9.7
A typical RISC architecture uses a boot ROM for system initialization. The boot ROM is also
required to access Mobile DiskOnChip G3 during the boot sequence in order to load OS images and
the device drivers.
M-Systems’ Boot Software Development Kit (BDK) and DOS utilities enable full control of Mobile
DiskOnChip G3 during the boot sequence. For a complete description of these products, refer to the
DiskOnChip Boot Software Development Kit (BDK) developer guide and the DiskOnChip Software
Utilities user manual. These tools enable the following operations:
•
•
•
Figure 25 illustrates the system boot flow using Mobile DiskOnChip G3 in a RISC architecture.
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Formatting Mobile DiskOnChip G3
Creating multiple partitions for different storage needs (OS images files, registry entry files,
backup partitions, and FAT/NFTL partitions)
Loading the OS image file
Boot Replacement
RAM
Boot Loader
Basic System Initialization
Boot Loader Copies
OS Image to R AM
OS Start-Up Code
Power-Up
Figure 25: System Boot Flow with Mobile DiskOnChip G3
OS Image
Preliminary Data Sheet, Rev. 1.1
Copy Image
to RAM
DiskOnChip G 3
Take Image from
Mobile DiskOnChip G3
(OS Image Storage)
Flash Disk Partition
BInary Partition
(File Storage)
Mobile DiskOnChip G3
91-SR-011-05-8L