FAN5009MPX Fairchild Semiconductor, FAN5009MPX Datasheet
FAN5009MPX
Specifications of FAN5009MPX
Related parts for FAN5009MPX
FAN5009MPX Summary of contents
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FAN5009 Dual Bootstrapped 12V MOSFET Driver Features • Drives N-channel High-Side and Low-Side MOSFETs in a synchronous buck configuration • 12V High-Side and 12V Low-Side Drive • Internal Adaptive “Shoot-Through” Protection • Integrated Bootstrap Diode for High-Side Drive • Fast ...
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FAN5009 Pin Configuration 1 8 BOOT PWM 2 7 FAN5009 VCC 5 4 FAN5009M 8-pin SO-8 package Pin Definitions Pin # Pin Name Pin Function Description 1 BOOT Bootstrap Supply Input. Provides voltage supply to high-side MOSFET ...
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PRODUCT SPECIFICATION Absolute Maximum Ratings Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated ...
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FAN5009 Electrical Specifications V = 12V, and T = 25°C using circuit in Figure 2 unless otherwise noted. The • denotes specifications which apply CC A over the full operating temperature range. Parameter Input Supply VCC Voltage Range VCC Current ...
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PRODUCT SPECIFICATION Electrical Specifications Parameter Low-Side Driver Output Resistance, Sourcing Current Output Resistance, Sinking Current 2,4 Transition Times 2,3 Propagation Delay NOTES: 1. All limits at operating temperature extremes are guaranteed by design, characterization and statistical quality control 2. AC ...
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FAN5009 Typical Characteristics PWM HDRV LDRV HDRV Rise/Fall Times vs RISE 1,000 2,000 3,000 C (pF) LOAD HDRV Impedance vs. Temperature (normalized) 1.5 1.4 1.3 Source 1.2 Sink 1.1 1.0 ...
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PRODUCT SPECIFICATION Typical Characteristics I vs. Frequency 100 200 300 Frequency (KHz) Negative SW Voltage Transient -13 -12 -11 - 100 200 300 Transient ...
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FAN5009 Circuit Description The FAN5009 is a dual MOSFET driver optimized for driv- ing N-channel MOSFETs in a synchronous buck converter topology. A single PWM input signal is all that is required to properly drive the high-side and the low-side ...
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PRODUCT SPECIFICATION Thermal Considerations Total device dissipation HDRV LDRV where P represents quiescent power dissipation: Q × 4mA + 0.036 ...
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FAN5009 5. The paddle on the MLP package is internally referenced to ground. It can be left floating or connected to ground. For best thermal performance it should be connected to ground as shown in Figure 7. C BOOT 1 ...
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PRODUCT SPECIFICATION Mechanical Dimensions 0.150, 8 Lead SOIC Package Inches Millimeters Symbol Min. Max. Min. A .053 .069 1.35 A1 .004 .010 0.10 B .013 .020 0.33 C .0075 .010 0.20 D .189 .197 4.80 E .150 .158 3.81 e ...
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FAN5009 Mechanical Dimensions 5mm x 6mm, 8 Lead MLP Package 5.0 0. TOP VIEW 0. 0.10 C 1.0 MAX C 0.08 SIDE VIEW 0.05 0.00 4.25 1. PIN #1 IDENT. (OPTIONAL 1.27 ...
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... Ordering Information Part Number FAN5009M FAN5009MX FAN5009MPX DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; ...