IDT89TTM552BL IDT, Integrated Device Technology Inc, IDT89TTM552BL Datasheet - Page 15

• Manufacturer Part Number: IDT89TTM552BL
• Description: IC TRAFFIC MANAGER 1192-FCBGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT89TTM552BL

• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 89TTM552BL

that meets the maximum ambient temperature requirements of their system.
thermal resistance of the package (junction to case + case to ambient) and is mainly specified as a reference parameter. (This is when a heat sink is
not present and the top surface of the package is essentially acting as the heat sink). However, in devices that have high power dissipation, heat sink
usage is highly desirable. Consequently, system designers may have limited use for this parameter.
IDT 89TSF500
The following graph depicts the ambient temperature (T
For system designers, specification of the maximum device junction temperature (operating) is critical, since it allows them to select a heat sink
The other parameter that is device package-specific is
80.0
70.0
60.0
50.0
40.0
30.0
1.0
*Notice: The information in this document is subject to change without notice
68.7
Figure 11 89TSF500 Ambient Temperature Curve
2.0
61.9
Ø
A
JA
) versus
Ambient Temp. vs Ø
, without a heat sink, and is specified for various air-flow conditions. This is the intrinsic
3.0
57.6
Ø
15 of 37
CA
Ø
4.0
.
CA
54.6
o
C/W
5.0
52.5
CA
6.0
50.8
7.0
49.5
8.0
48.5
November 23, 2004