MT9VDDT6472PHG-335F2 Micron Technology Inc, MT9VDDT6472PHG-335F2 Datasheet - Page 25

• Manufacturer Part Number: MT9VDDT6472PHG-335F2
• Description: MODULE DDR SDRAM 512MB 200SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT9VDDT6472PHG-335F2

• Memory Type: DDR SDRAM
• Memory Size: 512MB
• Speed: 333MT/s
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 72b
• Organization: 64Mx72
• Total Density: 512MByte
• Chip Density: 512Mb
• Access Time (max): 700ps
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 1.4A
• Number Of Elements: 9
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

NOTE:
pdf: 09005aef808ffe58, source: 09005aef808ffdc7
DD9C16_32_64_128x72PHG.fm - Rev. B 9/04 EN
1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM) across all modules.
2. The component case temperature measurements shown above were obtained experimentally. The typical system to be
3. Temperature versus air speed data is obtained by performing experiments with the system motherboard removed from
4. The memory diagnostic software used for determining worst-case component temperatures is a memory diagnostic soft-
used for experimental purposes is a dual-processor 600 MHz work station, fully loaded, with four comparable registered
memory modules. Case temperatures charted represent worst-case component locations on modules installed in the
internal slots of the system.
its case and mounted in a Eiffel-type low air speed wind tunnel. Peripheral devices installed on the system motherboard
for testing are the processor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel test
chamber.
ware application developed for internal use by Micron Technology, Inc.
100
90
80
70
60
50
40
30
20
Figure 11: Component Case Temperature vs. Air Flow
T
T
max
ave
128MB, 256MB, 512MB, 1GB (x72, ECC, PLL, SR)
- memory stress software
- memory stress software
T
ave
Air Flow (meters/sec)
- 3D gaming software
25
200-PIN DDR SDRAM SODIMM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Ambient Temperature = 25º C
Minimum Air Flow
©2004 Micron Technology, Inc. All rights reserved.
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