MT9HTF6472RHY-667D1 Micron Technology Inc, MT9HTF6472RHY-667D1 Datasheet
MT9HTF6472RHY-667D1
Specifications of MT9HTF6472RHY-667D1
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MT9HTF6472RHY-667D1 Summary of contents
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DDR2 SDRAM SORDIMM MT9HTF6472RH – 512MB MT9HTF12872RH – 1GB Features • 200-pin, small-outline registered dual in-line memo- ry module • Fast data transfer rates: PC2-4200, PC2-5300, or PC2-6400 • 512MB (64 Meg x 72) or 1GB (128 Meg x 72) ...
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... Table 3: Part Numbers and Timing Parameters – 512MB Modules 1 Base device: MT47H64M8, 512Mb DDR2 SDRAM Module 2 Part Number Density MT9HTF6472RH(I)Y-80E__ MT9HTF6472RH(I)Y-800__ MT9HTF6472RH(I)Y-667__ MT9HTF6472RH(I)Y-53E__ Table 4: Part Numbers and Timing Parameters – 1GB Modules 1 Base device: MT47H128M8, 1Gb DDR2 SDRAM Module 2 Part Number Density MT9HTF12872RH(I)Y-80E__ MT9HTF12872RH(I)Y-800__ MT9HTF12872RH(I)Y-667__ MT9HTF12872RH(I)Y-53E__ 1. The data sheet for the base device can be found on Micron’ ...
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Pin Assignments Table 5: Pin Assignments 200-Pin SORDIMM Front Pin Symbol Pin Symbol Pin DQ18 101 REF 3 DQ0 53 DQ19 103 105 DQ1 57 DQ24 107 9 DQS0# 59 ...
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... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR2 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 6: Pin Descriptions Symbol Type Ax Input BAx Input ...
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Table 6: Pin Descriptions (Continued) Symbol Type SDA I/O RDQSx, Output RDQS#x Err_Out# Output (open drain Supply DD DDQ V Supply DDSPD V Supply REF V Supply SS – NC – NF – NU – RFU PDF: 09005aef828742dd ...
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Functional Block Diagram Figure 2: Functional Block Diagram RS0# DQS0# DQS0 DM0 DM CS# DQS DQS# DQ0 DQ DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1# DQS1 DM1 DM CS# DQS DQS# DQ ...
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... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...
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Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in the device data ...
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... Design Considerations Simulations Micron memory modules are designed to optimize signal integrity through carefully de- signed terminations, controlled board impedances, routing topologies, trace length matching, and decoupling. However, good signal integrity starts at the system level. Mi- cron encourages designers to simulate the signal characteristics of the system's memo- ry bus to ensure adequate signal integrity of the entire memory system ...
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I Specifications DD Table 9: DDR2 I Specifications and Conditions – 512MB DD Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter Operating one bank ...
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Table 9: DDR2 I Specifications and Conditions – 512MB (Continued) DD Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter Operating bank interleave read current: ...
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Table 10: DDR2 I Specifications and Conditions – 1GB DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating one bank active-precharge current: ...
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Register and PLL Specifications Table 11: Register Specifications SSTU32872 devices or equivalent Parameter Symbol DC high-level V Control, command, IH(DC) input voltage DC low-level V Control, command, IL(DC) input voltage AC high-level V Control, command, IH(AC) input voltage AC low-level ...
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Table 12: PLL Specifications CUA845 device or JEDEC82-21 equivalent Parameter Symbol DC high-level V IH input voltage DC low-level V IL input voltage Input voltage (limits Input differential-pair V IX cross voltage Input differential volt- V ID(DC) age ...
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Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 14: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current: ...
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The interrupt mode enables software to reset EVENT# after a critical temperature thresh- old has been detected. Threshold points are set in the configuration register by the user. This mode triggers the critical temperature limit and both the MIN and ...
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Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 16: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...
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Table 17: Pointer Register Bits 0– Table 18: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...
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Table 20: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 21: Configuration Register (Address: 0x01) 15 ...
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Table 22: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...
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Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 23: Hysteresis Applied to Alarm ...
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Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...
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Table 27: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 28: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...
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Module Dimensions Figure 5: 200-Pin DDR2 SORDIMM 2.0 (0.079) R (2X) U1 1.0 (0.039) R (2X) 1.8 (0.071) (2X) 6.0 (0.236) TYP 2.0 (0.079) TYP U10 3.50 (0.138) TYP Pin 200 1.0 (0.039) TYP 1. All dimensions are in millimeters ...