OM11035 NXP Semiconductors, OM11035 Datasheet - Page 73

KIT EVAL LPC1768 CR

OM11035

Manufacturer Part Number
OM11035
Description
KIT EVAL LPC1768 CR
Manufacturer
NXP Semiconductors
Type
MCUr
Datasheet

Specifications of OM11035

Contents
Board and software
For Use With/related Products
LPC1768
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4815
NXP Semiconductors
Fig 38. Package outline SOT926-1 (TFBGA100)
LPC1769_68_67_66_65_64_63
Product data sheet
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
SOT926-1
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
G
K
H
E
D
C
B
A
F
J
0.65
0.8
A
2
1
IEC
- - -
2
0.5
0.4
b
e
3
9.1
8.9
4
D
5
e
D
1
9.1
8.9
JEDEC
6
E
All information provided in this document is subject to legal disclaimers.
- - -
1/2 e
7
REFERENCES
0.8
8
e
b
Rev. 6.01 — 11 March 2011
9
0
7.2
e
10
1
JEITA
7.2
e
- - -
2
1/2 e
scale
B
2.5
e
LPC1769/68/67/66/65/64/63
∅ v
∅ w
0.15
v
M
M
e
A
E
2
C
C
0.05
A
w
5 mm
A
B
0.08
A
y
1
32-bit ARM Cortex-M3 microcontroller
A
2
0.1
y
1
y
1
C
detail X
PROJECTION
EUROPEAN
X
C
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
05-12-09
05-12-22
SOT926-1
73 of 79

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