C8051F700DK Silicon Laboratories Inc, C8051F700DK Datasheet - Page 38

• Manufacturer Part Number: C8051F700DK
• Description: DEV KIT FOR C8051F700
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F700DK

• Contents: Board, Cables, CD, Debugger, Power Supply
• Processor To Be Evaluated: C8051F7x
• Processor Series: C8051F7xx
• Interface Type: USB
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051F7xx
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1635

C8051F70x/71x
38
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
pad is to be 60 m minimum, all the way around the pad.
solder paste release.
Components.
Dimension
C1
C2
E
X
Y
Table 4.2. TQFP-64 PCB Land Pattern Dimensions
Figure 4.2. TQFP-64 PCB Land Pattern
Rev. 1.0
11.30
11.30
0.20
1.40
Min
0.50 BSC
11.40
11.40
Max
0.30
1.50