PIC18F26K20-E/SO Microchip Technology, PIC18F26K20-E/SO Datasheet - Page 441

• Manufacturer Part Number: PIC18F26K20-E/SO
• Description: IC PIC MCU FLASH 16KX16 28-SOIC
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F26K20-E/SO

• Program Memory Type: FLASH
• Program Memory Size: 64KB (32K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 1K x 8
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3936 B
• Interface Type: CCP/ECCP/EUSART/I2C/MSSP/SPI
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 64 MHz
• Operating Supply Voltage: 2.5|3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPAC164303 - MODULE SKT FOR PM3 64TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Revision A (07/2006)
Original data sheet for PIC18F2XK20/4XK20 devices.
Revision B (03/2007)
Added
PIC18F46K20;
Section; Replaced Package Drawings.
Revision C (10/2007)
Revised Table 1, DIL Pins 34 and 35; Table 2, Pins 22
and 24; Table 1-2, Pins RB1 and RB3; Table 1-3, Pins
RB1 and RB3; Revised Sections 4.3, 4.4, 4.4.1, 4.4.2,
4.4.4; Revised Table 4-3, Note 2; Revised Table 6-1;
Revise Section 7.8: Revised Section 9.2; Revised
Examples 10-1 and 10-2; Revised Table 10-3, Pins
RB1 and RB3; Revised Sections 12.2 through 12.5;
Revised Register 16-1, bit 3-0; Revised Sections 16.1,
16.2, 16.4.4; Revised Register 16-2, bit 6-4; Revised
Table 16-2, Note 2; Revised Register 17-1, bit 6;
Revised Register 17-3; Revised Table 17-4; Revised
Register 19-1, added Note 2; Revised Register 20-3,
bits 5 and 4; Revised Register 23-4, bit 1; Revised Reg-
ister 23-12, bit 7-5; Revised Section 23.3; Revised Sec-
tion 24.1.1, instruction set descriptions; Revised
Section 26.0, voltage on MCLR; Revised DC Charac-
teristics 26.2, 26.3, 26.4 26.5, 26.6, 26.7, 26.8 and
26.10; Revised Tables 26-1, 26-6, 26-7, 26-9, 26-23.
Revision D (08/2008)
Update to Peripheral Highlights (USART module);
Deleted Section 2.2.6 (Oscillator Transitions); Revised
Sections 2.5.3, 2.9; Added Section 2.9.3 (Clock Switch
Timing); Deleted Section 2.10.4 (Clock Switching Tim-
ing); Replaced BAUDCTL with BAUDCON throughout;
Revised Table 5-2 (PLUSW0, PLUSW1, PLUSW2);
Add Note 1 to Table 7-1 (EEADRH); Revised Section
6.4.4 and Register 16-2 (FLT0 pin); Revised Registers
17-2 and 17-5 (SSPEN); Revised Register 17-6
(SEN); Added new paragraph after Figure 18-2;
Revised Note, Section 18.1.1; Deleted Note, Section
18.1.2; Added new Note 2, Sections 18.1.2.9 and
18.1.2.10; Revised Note 1, Section 18.3.1; Added
Section 18.3.2; Revised Section 18.3.5; Added new
Note 2, Sections 18.4.1.5, 18.4.1.10, 18.4.2.2,
18.4.2.4; Revised Register 21-1 (CVR); Revised Note
1, Registers 23-6, 23.8, 23-10, Table 23-3; Added new
Figure 26-1; Revised 26.2, 26.6, 26.7 (Note 3), 26.8,
26.9, 26.10; Revised Tables 26-1, 26-2, 26-3, 26-6, 26-
7, 26-8, 26-25; Updated Package Drawings.
 2010 Microchip Technology Inc.
part
Replaced
numbers
REVISION HISTORY
Development
PIC18F26K20
Support
and
Revision E (04/2009)
Revised data sheet title; Revised Power-Managed
Modes, Peripheral Highlights, and Analog Features;
Revised 26.2, DC Char. table.
Revision F (09/2009)
Changed the values in the “Extreme Low-Power
Management with nanoWatt XLP” section; Added new
Note
Characteristics section; Added charts to the DS
Characteristics section; Removed Preliminary label;
Added UQFN to Pin Diagrams; Added the 28-pin
UQFN to Table 3-1; Updated MSSP section (Register
17-3; changing SSPADD<6:0> to SSPADD<7:0>);
Updated the Development Support section deleting
section 25.7; Added the 28-Lead UQFN package
marking diagrams and the 28-Lead Plastic Ultra Thin
Quad Flat, No Lead Package (MV) - 4X4X0.5 mm Body
(UQFN) package to Packaging Information section;
Other minor corrections.
Revision G (01/2010)
Updated Figure 9-1; Reviewed Section 26 (Electrical
Characteristics); Added Figures 27-29, 27-30, 27-31
and 27-32 to Section 27 (DC and AC Characteristics
Graphs and Tables); Reviewed Product Identification
System section.
PIC18F2XK20/4XK20
2
to
Pin
Diagrams;
Updated
DS41303G-page 441
Electrical