PIC24FJ64GA006-I/PT Microchip Technology, PIC24FJ64GA006-I/PT Datasheet - Page 212

• Manufacturer Part Number: PIC24FJ64GA006-I/PT
• Description: IC PIC MCU FLASH 32KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ64GA006-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: I²C, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, DV164033, MA240013, AC164127, DM240001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Controller Family/series: PIC24
• No. Of I/o's: 53
• Ram Memory Size: 8KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM240011 - KIT STARTER MPLAB FOR PIC24F MCUDV164033 - KIT START EXPLORER 16 MPLAB ICD2MA160011 - DAUGHTER BOARD PICDEM LCD 16F91XDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24FJ128GA010 FAMILY
26.1
TABLE 26-1:
TABLE 26-2:
TABLE 26-3:
TABLE 26-4:
DS39747E-page 212
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
Note 1:
PIC24FJ128GA010 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 14x14x1 mm TQFP
Package Thermal Resistance, 12x12x1 mm TQFP
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Param
No.
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
2:
Supply Voltage
V
V
V
V
V
S
DC Characteristics
P
P
Symbol
INT
I
DD
DD
DDCORE
DR
POR
VDD
/
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
This is the limit to which V
O
Junction to ambient thermal resistance, Theta-
V
(in Volts)
= Σ ({V
DD
2.0-3.6V
= V
Range
DD
OPERATING MIPS vs. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
RAM Data Retention
Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
x (I
DD
DD
DD
DD
– V
Start Voltage
Rise Rate
Characteristic
Characteristic
– Σ I
OH
(2)
} x I
Rating
OH
OH
)
) + Σ (V
DD
can be lowered without losing RAM data.
OL
Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature
x I
V
-40°C to +85°C
DDCORE
OL
0.05
Temp Range
Min
2.7
2.0
1.5
—
)
(in °C)
JA
Typ
(
V
θ
—
—
—
—
—
SS
JA
(1)
) numbers are achieved by package simulations.
Symbol
Symbol
P
Max
2.75
DMAX
θ
θ
θ
P
3.6
3.6
T
T
-40°C ≤ T
—
—
—
JA
JA
JA
A
D
J
Units
V/ms
69.4
76.6
Min
Typ
-40
-40
A
50
V
V
V
V
V
PIC24FJ128GA010 Family
≤ +85°C for Industrial
(T
© 2009 Microchip Technology Inc.
P
Regulator enabled
Regulator disabled
Regulator disabled
0-3.3V in 0.1s
0-2.5V in 60 ms
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
+ P
A
)/
16
θ
I
/
Conditions
O
JA
°C/W
°C/W
°C/W
+125
Max
Unit
+85
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W