DSPIC30F3010-20I/SP Microchip Technology, DSPIC30F3010-20I/SP Datasheet - Page 215

• Manufacturer Part Number: DSPIC30F3010-20I/SP
• Description: IC DSPIC MCU/DSP 24K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3010-20I/SP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 24KB (8K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 24KB
• Supply Voltage Range: 2.5V To 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301020ISP

APPENDIX A:
Revision B (May 2006)
Previous versions of this data sheet contained
Advance or Preliminary Information. They were
distributed with incomplete characterization data.
This revision reflects these updates:
• Supported I
• ADC Conversion Clock selection to allow 1 Msps
• Operating Current (I
• Power-Down Current (I
• I/O pin Input Specifications
• BOR voltage limits
• Watchdog Timer time-out limits
Revision C (September 2006)
Updates
Characteristics”.
Revision D (January 2007)
This revision includes updates to the packaging
diagrams.
© 2008 Microchip Technology Inc.
(see Table 17-1)
operation (see Section 19.0 “10-bit High-Speed
Analog-to-Digital Converter (ADC) Module”)
(see Table 23-5)
(see Table 23-7)
(see Table 23-8)
(see Table 23-10)
(see Table 23-20)
made
2
C Slave Addresses
to
DD
REVISION HISTORY
) Specifications
PD
Section 23.0
)
“Electrical
Revision E (April 2008)
This revision reflects these updates:
• Added OSCTUN register information and updated
• Changed the location of the input reference in the
• Added Fuse Configuration Register (FICD) details
• Added Note 2 in Device Configuration Registers
• Updated FOSC register bit definition in Device
• Electrical Specifications:
• Additional minor corrections throughout the
the OSCCON register information (removed TUN
bits) in System Integration Register Map (see
Table 20-7)
10-Bit High-Speed ADC Functional Block
Diagram (see Figure 19-1)
(see Section 20.6 “Device Configuration
Registers” and Table 20-8)
table (Table 20-8)
Configuration Registers table (Table 20-8)
- Updated values for parameters DO10, DO16,
- 10-Bit High-Speed ADC t
- Parameter OS65 (Internal RC Accuracy) has
- Parameter DC12 (RAM Data Retention Volt-
- Parameter D134 (Erase/Write Cycle Time)
- Removed parameters OS62 (Internal FRC
- Parameter OS63 (Internal FRC Accuracy)
- Updated Min and Max values and Conditions
document
dsPIC30F3010/3011
DO20, and DO26 (see Table 23-9)
ter (time to stabilize) has been updated from
20 µs typical to 20 µs maximum (see
Table 23-39)
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table 23-18)
age) has been updated to include a Min value
(see Table 23-4)
has been updated to include Min and Max
values and the Typ value has been removed
(see Table 23-11)
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table 23-17)
has been expanded to reflect multiple Min
and Max values for different temperatures
(see Table 23-17)
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for
parameter SY20 (see Table 23-20)
PDU
timing parame-
DS70141E-page 213