IC DSPIC MCU/DSP 128K 100-TQFP

DSPIC33FJ128GP310A-I/PT

Manufacturer Part NumberDSPIC33FJ128GP310A-I/PT
DescriptionIC DSPIC MCU/DSP 128K 100-TQFP
ManufacturerMicrochip Technology
SeriesdsPIC™ 33F
DSPIC33FJ128GP310A-I/PT datasheet
 

Specifications of DSPIC33FJ128GP310A-I/PT

Program Memory TypeFLASHProgram Memory Size128KB (128K x 8)
Package / Case100-TFQFPCore ProcessordsPIC
Core Size16-BitSpeed40 MIPs
ConnectivityI²C, IrDA, LIN, SPI, UART/USARTPeripheralsAC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o85Ram Size16K x 8
Voltage - Supply (vcc/vdd)3 V ~ 3.6 VData ConvertersA/D 32x10b/12b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
ProductDSCsData Bus Width16 bit
Processor SeriesDSPIC33FCoredsPIC
Maximum Clock Frequency40 MHzNumber Of Programmable I/os85
Data Ram Size16 KBMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development Tools52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By SupplierPG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033Minimum Operating Temperature- 40 C
Lead Free Status / RoHS StatusLead free / RoHS CompliantFor Use With876-1001 - DSPIC33 BREAKOUT BOARD
Eeprom Size-  
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dsPIC33FJXXXGPX06A/X08A/X10A
2.0
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Note 1: This data sheet summarizes the features
of
the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. It is not intended
to be a comprehensive reference source.
To complement the information in this
data sheet, refer to the “dsPIC33F/
PIC24H
Family
Reference
Please see the Microchip web site
(www.microchip.com)
for
dsPIC33F/PIC24H
Family
Manual sections.
2: Some registers and associated bits
described in this section may not be avail-
able on all devices. Refer to Section 4.0
“Memory Organization” in this data
sheet for device-specific register and bit
information.
2.1
Basic Connection Requirements
Getting started with the dsPIC33FJXXXGPX06A/
X08A/X10A family of 16-bit Digital Signal Controllers
(DSCs) requires attention to a minimal set of device pin
connections before proceeding with development. The
following is a list of pin names, which must always be
connected:
• All V
and V
pins
DD
SS
(see Section 2.2 “Decoupling Capacitors”)
• All AV
and AV
pins (regardless if ADC module
DD
SS
is not used)
(see Section 2.2 “Decoupling Capacitors”)
• V
/V
CAP
DDCORE
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (V
/V
)”)
CAP
DDCORE
• MCLR pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
• PGECx/PGEDx pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
• OSC1 and OSC2 pins when external oscillator
source is used
(see Section 2.6 “External Oscillator Pins”)
Additionally, the following pins may be required:
• V
+/V
- pins used when external voltage
REF
REF
reference for ADC module is implemented
Note:
The AV
and AV
DD
SS
connected independent of the ADC
voltage reference source.
 2009 Microchip Technology Inc.
2.2
Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
is required.
SS
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
Manual”.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
the
latest
to the pins as possible. It is recommended to
Reference
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
• Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
pins must be
Preliminary
, V
, AV
and
DD
SS
DD
DS70593B-page 25