MB95F118JWPMC-GE1 Fujitsu Semiconductor America Inc, MB95F118JWPMC-GE1 Datasheet - Page 71

• Manufacturer Part Number: MB95F118JWPMC-GE1
• Description: IC MCU 60K FLASH 2KB RAM 52LQFP
• Manufacturer: Fujitsu Semiconductor America Inc
• Series: F²MC MB95110Mr

Specifications of MB95F118JWPMC-GE1

• Core Processor: F²MC-8FX
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, LIN, SIO, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 5.5 V
• Data Converters: A/D 8x8/10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 52-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: 865-1071

■ PACKAGE DIMENSION
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/fj/DATASHEET/ef-ovpklv.html
C
2005 FUJITSU LIMITED F52001S-c-1-1
40
52
LEAD No.
52-pin plastic LQFP
(FPT-52P-M01)
39
1
*
12.00 ± 0.20(.472 ± .008)SQ
10.00 ± 0.10(.394 ± .004)SQ
INDEX
0.65(.026)
52-pin plastic LQFP
(FPT-52P-M01)
0.30
.012
27
13
+0.065
– 0.035
+.0027
– .0014
0.13(.005)
26
14
M
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
"A"
0.145 ± 0.055
(.006 ± .002)
Package width ×
Sealing method
package length
Mounting height
Lead shape
(Reference)
0.10(.004)
Lead pitch
Code
Dimensions in mm (inches).
Note: The values in parentheses are reference values
MB95110M Series
Details of "A" part
(.024 ± .006)
(.020 ± .008)
0.50 ± 0.20
0.60 ± 0.15
1.50
.059
0
˚
~8
+0.20
– 0.10
+.008
– .004
˚
P-LQFP52-10×10-0.65
(Mounting height)
10.0 × 10.0 mm
1.70 mm Max
Plastic mold
0.65 mm
Gullwing
0.25(.010)
(.004 ± .004)
0.10 ± 0.10
(Stand off)
71