IC ARM7 MCU 512K LCD 208-LQFP

LPC2478FBD208,551

Manufacturer Part NumberLPC2478FBD208,551
DescriptionIC ARM7 MCU 512K LCD 208-LQFP
ManufacturerNXP Semiconductors
SeriesLPC2400
LPC2478FBD208,551 datasheets
 

Specifications of LPC2478FBD208,551

Program Memory TypeFLASHProgram Memory Size512KB (512K x 8)
Package / Case208-LQFPCore ProcessorARM7
Core Size16/32-BitSpeed72MHz
ConnectivityCAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTGPeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o160Ram Size96K x 8
Voltage - Supply (vcc/vdd)3 V ~ 3.6 VData ConvertersA/D 8x10b; D/A 1x10b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Processor SeriesLPC24CoreARM7TDMI-S
Data Bus Width16 bit, 32 bitData Ram Size98 KB
Interface TypeCAN/I2C/I2S/IrDA/SPI/SSP/UART/USBMaximum Clock Frequency72 MHz
Number Of Programmable I/os160Number Of Timers4
Operating Supply Voltage3.3 VMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsMDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
Development Tools By SupplierOM11015, OM11019, OM11022Minimum Operating Temperature- 40 C
On-chip Adc8-ch x 10-bitOn-chip Dac1-ch x 10-bit
Lead Free Status / RoHS StatusLead free / RoHS CompliantFor Use With622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size-Other names568-4363
935284069551
LPC2478FBD208-S
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LPC2478
Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN,
LCD, USB 2.0 device/host/OTG, external memory interface
Rev. 2 — 29 September 2010
1. General description
NXP Semiconductors designed the LPC2478 microcontroller, powered by the
ARM7TDMI-S core, to be a highly integrated microcontroller for a wide range of
applications that require advanced communications and high quality graphic displays. The
LPC2478 microcontroller has 512 kB of on-chip high-speed flash memory. This flash
memory includes a special 128-bit wide memory interface and accelerator architecture
that enables the CPU to execute sequential instructions from flash memory at the
maximum 72 MHz system clock rate. This feature is available only on the LPC2000 ARM
microcontroller family of products. The LPC2478, with real-time debug interfaces that
include both JTAG and embedded trace, can execute both 32-bit ARM and 16-bit Thumb
instructions.
The LPC2478 microcontroller incorporates an LCD controller, a 10/100 Ethernet Media
Access Controller (MAC), a USB full-speed Device/Host/OTG Controller with 4 kB of
endpoint RAM, four UARTs, two Controller Area Network (CAN) channels, an SPI
interface, two Synchronous Serial Ports (SSP), three I
Supporting this collection of serial communications interfaces are the following feature
components; an on-chip 4 MHz internal oscillator, 98 kB of total RAM consisting of 64 kB
of local SRAM, 16 kB SRAM for Ethernet, 16 kB SRAM for general purpose DMA, 2 kB of
battery powered SRAM, and an External Memory Controller (EMC). These features make
this device optimally suited for portable electronics and Point-of-Sale (POS) applications.
Complementing the many serial communication controllers, versatile clocking capabilities,
and memory features are various 32-bit timers, a 10-bit ADC, 10-bit DAC, two PWM units,
and up to 160 fast GPIO lines. The LPC2478 connects 64 of the GPIO pins to the
hardware based Vector Interrupt Controller (VIC) that means these external inputs can
generate edge-triggered interrupts. All of these features make the LPC2478 particularly
suitable for industrial control and medical systems.
2. Features and benefits
ARM7TDMI-S processor, running at up to 72 MHz.
512 kB on-chip flash program memory with In-System Programming (ISP) and
In-Application Programming (IAP) capabilities. Flash program memory is on the ARM
local bus for high performance CPU access.
98 kB on-chip SRAM includes:
64 kB of SRAM on the ARM local bus for high performance CPU access.
16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM.
16 kB SRAM for general purpose DMA use also accessible by the USB.
2 kB SRAM data storage powered from the Real-Time Clock (RTC) power domain.
Product data sheet
2
2
C interfaces, and an I
S interface.

LPC2478FBD208,551 Summary of contents

  • Page 1

    ... LCD, USB 2.0 device/host/OTG, external memory interface Rev. 2 — 29 September 2010 1. General description NXP Semiconductors designed the LPC2478 microcontroller, powered by the ARM7TDMI-S core highly integrated microcontroller for a wide range of applications that require advanced communications and high quality graphic displays. The LPC2478 microcontroller has 512 kB of on-chip high-speed flash memory. This flash ...

  • Page 2

    ... NXP Semiconductors LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film Transistors (TFT) displays. Dedicated DMA controller. Selectable display resolution (up to 1024 × 768 pixels). Supports up to 24-bit true-color mode. Dual Advanced High-performance Bus (AHB) system allows simultaneous Ethernet DMA, USB DMA, and program execution from on-chip flash with no contention. ...

  • Page 3

    ... NXP Semiconductors Processor wake-up from Power-down mode via any interrupt able to operate during Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet wake-up interrupt, CAN bus activity, port 0/2 pin interrupt). Two independent power domains allow fine tuning of power consumption based on needed features ...

  • Page 4

    ... NXP Semiconductors 4.1 Ordering options Table 2. Ordering options Type number Flash SRAM (kB) (kB) LPC2478FBD208 512 LPC2478FET208 512 LPC2478 Product data sheet External Ethernet USB bus OTG/ OHC/ device + 4 kB FIFO 98 Full MII/RMII yes 32-bit 98 Full MII/RMII yes 32-bit All information provided in this document is subject to legal disclaimers. ...

  • Page 5

    ... NXP Semiconductors 5. Block diagram LPC2478 P0, P1, P2, P3, P4 HIGH-SPEED GPIO 160 PINS TOTAL AHB2 ETHERNET MII/RMII MAC WITH DMA EINT3 to EINT0 EXTERNAL INTERRUPTS P0 × CAP0/CAP1/ CAPTURE/COMPARE CAP2/CAP3 TIMER0/TIMER1/ 4 × MAT2/MAT3, TIMER2/TIMER3 2 × MAT0, 3 × MAT1 6 × PWM0/PWM1 PWM0, PWM1 1 × PCAP0, 2 × PCAP1 ...

  • Page 6

    ... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. LPC2478 pinning LQFP208 package Fig 3. LPC2478 pinning TFBGA208 package Table 3. Pin allocation table Pin Symbol Pin Symbol Row A 1 P3[27]/D27/ 2 CAP1[0]/PWM1[4] 5 P1[4]/ENET_TX_EN 6 9 P1[17]/ENET_MDIO 10 LPC2478 Product data sheet 1 LPC2478FBD208 52 ball A1 ...

  • Page 7

    ... NXP Semiconductors Table 3. Pin allocation table Pin Symbol Pin Symbol 13 P3[20]/D20/ 14 PWM0[5]/DSR1 17 P1[5]/ENET_TX_ER/ MCIPWR/PWM0[3] Row B 1 P3[2]/ P1[1]/ENET_TXD1 6 9 P4[25]/ DD(3V3) 17 P2[0]/PWM1[1]/TXD1/ TRACECLK/LCDPWR Row C 1 P3[13]/D13 2 5 P3[9]/ DD(3V3) 13 P0[7]/I2STX_CLK/ 14 LCDVD[9]/SCK1/ MAT2[1] ...

  • Page 8

    ... NXP Semiconductors Table 3. Pin allocation table Pin Symbol Pin Symbol 14 P4[11]/A11 15 Row G 1 P3[5]/ n.c. 15 Row H 1 P0[23]/AD0[0]/ 2 I2SRX_CLK/CAP3[ SSIO Row J 1 P3[6]/ P0[16]/RXD1/ 15 SSEL0/SSEL Row K 1 VREF 2 14 P4[22]/A22/ 15 TXD2/MISO1 Row L 1 P3[7]/ n.c. 15 Row M 1 P3[15]/D15 ...

  • Page 9

    ... NXP Semiconductors Table 3. Pin allocation table Pin Symbol Pin Symbol 9 P1[23]/USB_RX_DP1/ 10 LCDVD[9]/LCDVD[13]/ PWM1[4]/MISO0 13 P2[15]/CS3/ 14 CAP2[1]/SCL1 17 V DD(3V3) Row R 1 P0[12]/USB_PPWR2/ 2 MISO1/AD0[6] 5 P3[24]/D24/ 6 CAP0[1]/PWM1[ SSIO 13 P2[17]/RAS 14 17 P4[20]/A20/SDA2/SCK1 Row T 1 P0[27]/SDA0 ...

  • Page 10

    ... NXP Semiconductors 6.2 Pin description Table 4. Pin description Symbol Pin Ball P0[0] to P0[31] [1] P0[0]/RD1/TXD3/ 94 U15 SDA1 [1] P0[1]/TD1/RXD3/ 96 T14 SCL1 [1] P0[2]/TXD0 202 C4 [1] P0[3]/RXD0 204 D6 [1] P0[4]/I2SRX_CLK/ 168 B12 LCDVD[0]/RD2/ CAP2[0] [1] P0[5]/I2SRX_WS/ 166 C12 LCDVD[1]/TD2/ ...

  • Page 11

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P0[7]/I2STX_CLK/ 162 C13 LCDVD[9]/SCK1/ MAT2[1] [1] P0[8]/I2STX_WS/ 160 A15 LCDVD[16]/ MISO1/MAT2[2] [1] P0[9]/I2STX_SDA/ 158 C14 LCDVD[17]/ MOSI1/MAT2[3] [1] P0[10]/TXD2/ 98 T15 SDA2/MAT3[0] [1] P0[11]/RXD2/ 100 R14 SCL2/MAT3[1] [2] P0[12 USB_PPWR2/ MISO1/AD0[6] [2] P0[13]/ ...

  • Page 12

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P0[14 USB_HSTEN2/ USB_CONNECT2/ SSEL1 [1] P0[15]/TXD1/ 128 J16 SCK0/SCK [1] P0[16]/RXD1/ 130 J14 SSEL0/SSEL [1] P0[17]/CTS1/ 126 K17 MISO0/MISO [1] P0[18]/DCD1/ 124 K15 MOSI0/MOSI [1] P0[19]/DSR1/ 122 L17 MCICLK/SDA1 [1] P0[20]/DTR1/ 120 ...

  • Page 13

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [2] P0[23]/AD0[0 I2SRX_CLK/ CAP3[0] [2] P0[24]/AD0[1 I2SRX_WS/ CAP3[1] [2] P0[25]/AD0[2 I2SRX_SDA/ TXD3 [2][3] P0[26]/AD0[3 AOUT/RXD3 [4] P0[27]/SDA0 50 T1 [4] P0[28]/SCL0 48 R3 [5] P0[29]/USB_D [5] P0[30]/USB_D− [5] P0[31]/USB_D P1[0] to P1[31] [1] P1[0]/ ...

  • Page 14

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P1[3]/ 177 A10 ENET_TXD3/ MCICMD/ PWM0[2] [1] P1[4]/ 192 A5 ENET_TX_EN [1] P1[5]/ 156 A17 ENET_TX_ER/ MCIPWR/ PWM0[3] [1] P1[6]/ 171 B11 ENET_TX_CLK/ MCIDAT0/ PWM0[4] [1] P1[7]/ 153 D14 ENET_COL/ MCIDAT1/ PWM0[5] [1] P1[8]/ 190 C7 ENET_CRS_DV/ ENET_CRS [1] P1[9]/ ...

  • Page 15

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P1[16]/ 180 D10 ENET_MDC [1] P1[17]/ 178 A9 ENET_MDIO [1] P1[18 USB_UP_LED1/ PWM1[1]/CAP1[0] [1] P1[19 USB_TX_E1/ USB_PPWR1/ CAP1[1] [1] P1[20 USB_TX_DP1/ LCDVD[6]/ LCDVD[10]/ PWM1[2]/SCK0 [1] P1[21 USB_TX_DM1/ LCDVD[7]/ LCDVD[11]/ PWM1[3]/SSEL0 [1] P1[22]/USB_RCV1 LCDVD[8]/ LCDVD[12]/ USB_PWRD1/ ...

  • Page 16

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P1[25]/USB_LS1/ 80 T10 LCDVD[11]/ LCDVD[15]/ USB_HSTEN1/ MAT1[1] [1] P1[26]/ 82 R10 USB_SSPND1/ LCDVD[12]/ LCDVD[20]/ PWM1[6]/CAP0[0] [1] P1[27]/USB_INT1/ 88 T12 LCDVD[13]/ LCDVD[21]/ USB_OVRCR1/ CAP0[1] [1] P1[28]/USB_SCL1/ 90 T13 LCDVD[14]/ LCDVD[22]/ PCAP1[0]/MAT0[0] [1] P1[29]/USB_SDA1/ 92 U14 LCDVD[15]/ ...

  • Page 17

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P2[0]/PWM1[1]/ 154 B17 TXD1/TRACECLK/ LCDPWR [1] P2[1]/PWM1[2]/ 152 E14 RXD1/PIPESTAT0/ LCDLE [1] P2[2]/PWM1[3]/ 150 D15 CTS1/PIPESTAT1/ LCDDCLK [1] P2[3]/PWM1[4]/ 144 E16 DCD1/PIPESTAT2/ LCDFP [1] P2[4]/PWM1[5]/ 142 D17 DSR1/ TRACESYNC/ LCDENAB/LCDM [1] P2[5]/PWM1[6]/ ...

  • Page 18

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P2[8]/TD2/TXD2/ 134 H15 TRACEPKT3/ LCDVD[2]/ LCDVD[6] [1] P2[9]/ 132 H16 USB_CONNECT1/ RXD2/EXTIN0/ LCDVD[3]/ LCDVD[7] [6] P2[10]/EINT0 110 N15 [6] P2[11]/EINT1/ 108 T17 LCDCLKIN/ MCIDAT1/ I2STX_CLK [6] P2[12]/EINT2/ 106 N14 LCDVD[4]/ LCDVD[3]/ LCDVD[8]/ ...

  • Page 19

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P2[16]/CAS 87 R11 [1] P2[17]/RAS 95 R13 [1] P2[18 CLKOUT0 [1] P2[19 CLKOUT1 [1] P2[20]/DYCS0 73 T8 [1] P2[21]/DYCS1 81 U11 [1] P2[22]/DYCS2/ 85 U12 CAP3[0]/SCK0 [1] P2[23]/DYCS3 CAP3[1]/SSEL0 [1] P2[24 CKEOUT0 [1] P2[25 CKEOUT1 [1] P2[26 CKEOUT2/ MAT3[0]/MISO0 ...

  • Page 20

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P2[31 DQMOUT3/ MAT3[3]/SCL2 P3[0] to P3[31] [1] P3[0]/D0 197 B4 [1] P3[1]/D1 201 B3 [1] P3[2]/D2 207 B1 [1] P3[3]/ [1] P3[4]/ [1] P3[5]/ [1] P3[6]/ [1] P3[7]/ [1] P3[8]/D8 191 D8 [1] P3[9]/D9 199 C5 [1] P3[10]/D10 205 B2 [1] P3[11]/D11 ...

  • Page 21

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P3[16]/D16/ 137 F17 PWM0[1]/TXD1 [1] P3[17]/D17/ 143 F15 PWM0[2]/RXD1 [1] P3[18]/D18/ 151 C15 PWM0[3]/CTS1 [1] P3[19]/D19/ 161 B14 PWM0[4]/DCD1 [1] P3[20]/D20/ 167 A13 PWM0[5]/DSR1 [1] P3[21]/D21/ ...

  • Page 22

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P3[26]/D26 MAT0[1]/ PWM1[3] [1] P3[27]/D27/ 203 A1 CAP1[0]/ PWM1[4] [1] P3[28]/D28 CAP1[1]/ PWM1[5] [1] P3[29]/D29 MAT1[0]/ PWM1[6] [1] P3[30]/D30 MAT1[1]/ RTS1 [1] P3[31]/D31 MAT1[2] P4[0] to P4[31] [1] P4[0]/ [1] P4[1]/A1 79 U10 [1] P4[2]/A2 83 ...

  • Page 23

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P4[7]/A7 121 L16 [1] P4[8]/A8 127 J17 [1] P4[9]/A9 131 H17 [1] P4[10]/A10 135 G17 [1] P4[11]/A11 145 F14 [1] P4[12]/A12 149 C16 [1] P4[13]/A13 155 B16 [1] P4[14]/A14 159 B15 [1] P4[15]/A15 173 ...

  • Page 24

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [1] P4[23]/A23/ 129 J15 RXD2/MOSI1 [1] P4[24]/OE 183 B8 [1] P4[25]/WE 179 B9 [1] P4[26]/BLS0 119 L15 [1] P4[27]/BLS1 139 G15 [1] P4[28]/BLS2/ 170 C11 MAT2[0]/LCDVD[6]/ LCDVD[10]/ LCDVD[2]/ TXD3 [1] P4[29]/BLS3/ 176 B10 ...

  • Page 25

    ... NXP Semiconductors Table 4. Pin description …continued Symbol Pin Ball [7] RESET 35 M2 [8][9] XTAL1 44 M4 [8][9] XTAL2 46 N4 [8][10] RTCX1 34 K2 [8][10] RTCX2 33, 63, L3, T5, SSIO 77, 93, R9, P12, 114, N16, 133, H14, 148, E15, 169, A12, B6, 189, A2 [11] 200 V 32, 84, K4, P10, ...

  • Page 26

    ... NXP Semiconductors [5] Pad provides digital I/O and USB functions designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). [ tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis. [ tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis. ...

  • Page 27

    ... NXP Semiconductors 7. Functional description 7.1 Architectural overview The LPC2478 microcontroller consists of an ARM7TDMI-S CPU with emulation support, the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external memory, and the AMBA APB for connection to other on-chip peripheral functions. The microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte order ...

  • Page 28

    ... NXP Semiconductors The Thumb set’s 16-bit instruction length allows it to approach higher density compared to standard ARM code while retaining most of the ARM’s performance. 7.2 On-chip flash programming memory The LPC2478 incorporates 512 kB flash memory system. This memory may be used for both code and data storage ...

  • Page 29

    ... NXP Semiconductors 7.4 Memory map The LPC2478 memory map incorporates several distinct regions as shown in Figure 4. In addition, the CPU interrupt vectors may be remapped to allow them to reside in either flash memory (default), boot ROM, or SRAM (see Table 5. Address range General use 0x0000 0000 to ...

  • Page 30

    ... NXP Semiconductors 3.75 GB Fig 4. 7.5 Interrupt controller The ARM processor core has two interrupt inputs called Interrupt Request (IRQ) and Fast Interrupt Request (FIQ). The VIC takes 32 interrupt request inputs which can be programmed as FIQ or vectored IRQ types. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted ...

  • Page 31

    ... NXP Semiconductors service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a programmable interrupt priority ...

  • Page 32

    ... NXP Semiconductors – Asynchronous page mode read – Programmable Wait States – Bus turnaround delay – Output enable and write enable delays – Extended wait • Four chip selects for synchronous memory and four chip selects for static memory devices. • ...

  • Page 33

    ... NXP Semiconductors • One AHB master for transferring data. This interface transfers data when a DMA request goes active. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data ...

  • Page 34

    ... NXP Semiconductors 7.10 LCD controller The LCD controller provides all of the necessary control signals to interface directly to a variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can 1024 × 768 pixels ...

  • Page 35

    ... NXP Semiconductors The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic in the LPC2478 takes place on a different AHB subsystem, effectively separating Ethernet activity from the rest of the system. The Ethernet DMA can also access off-chip memory via the EMC, as well as the SRAM located on another AHB ...

  • Page 36

    ... NXP Semiconductors 7.12 USB interface The Universal Serial Bus (USB 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot plugging and dynamic configuration of the devices. All transactions are initiated by the host controller ...

  • Page 37

    ... NXP Semiconductors 7.12.3 USB OTG controller USB OTG is a supplement to the USB 2.0 Specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals. The OTG Controller integrates the host controller, device controller, and a master-only I interface to implement OTG dual-role device functionality ...

  • Page 38

    ... NXP Semiconductors 7.14 10-bit ADC The LPC2478 contains one ADC single 10-bit successive approximation ADC with eight channels. 7.14.1 Features • 10-bit successive approximation ADC • Input multiplexing among 8 pins • Power-down mode • Measurement range 10-bit conversion time ≥ 2.44 μs • ...

  • Page 39

    ... NXP Semiconductors • UART3 includes an IrDA mode to support infrared communication. 7.17 SPI serial I/O controller The LPC2478 contains one SPI controller. SPI is a full duplex serial interface designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer ...

  • Page 40

    ... NXP Semiconductors • Conforms to Multimedia Card Specification v2.11. • Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96. • Can be used as a multimedia card bus or a secure digital memory card bus host. The SD/MMC can be connected to several multimedia cards or a single secure digital memory card. • ...

  • Page 41

    ... NXP Semiconductors 7.21.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1, 48) kHz. • ...

  • Page 42

    ... NXP Semiconductors 7.23 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2478. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers ...

  • Page 43

    ... NXP Semiconductors • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • ...

  • Page 44

    ... NXP Semiconductors The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. When the CPU and the rest of chip functions are stopped and power removed, the RTC can supply an alarm output that can be used by external hardware to restore chip power and resume operation ...

  • Page 45

    ... NXP Semiconductors PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to 7.26.1.3 RTC oscillator The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the RTC oscillator can be used to drive the PLL and the CPU ...

  • Page 46

    ... NXP Semiconductors 7.26.4 Power control The LPC2478 supports a variety of power control features. There are four special modes of processor power reduction: Idle mode, Sleep mode, Power down-mode and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements ...

  • Page 47

    ... NXP Semiconductors the meantime, the flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 μs flash start-up time. When it times out, access to the flash will be allowed. The customers need to reconfigure the PLL and clock dividers accordingly. 7.26.4.4 Deep power-down mode Deep power-down mode is similar to the Power-down mode, but now the on-chip regulator that supplies power to the internal logic is also shut off ...

  • Page 48

    ... NXP Semiconductors 7.27 System control 7.27.1 Reset Reset has four sources on the LPC2478: the RESET pin, the Watchdog reset, power-on reset, and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains a usable ...

  • Page 49

    ... NXP Semiconductors CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device. 7.27.4 AHB The LPC2478 implements two AHB in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the Vectored Interrupt Controller, GPDMA controller, USB interface, and 16 kB SRAM ...

  • Page 50

    ... NXP Semiconductors DCC is accessed as a coprocessor 14 by the program running on the ARM7TDMI-S core. The DCC allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The DCC data and control registers are mapped in to addresses in the EmbeddedICE logic ...

  • Page 51

    ... NXP Semiconductors 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage (3.3 V) DD(3V3) V DC-to-DC converter supply voltage DD(DCDC)(3V3) (3 analog 3.3 V pad supply voltage DDA V input voltage on pin VBAT i(VBAT) V input voltage on pin VREF ...

  • Page 52

    ... NXP Semiconductors 9. Thermal characteristics The average chip junction temperature, T equation amb • T amb • R th(j-a) • The internal power dissipation is the product of I the I/O pins is often small and many times can be negligible. However it can be significant in some applications. Table 7. Thermal characteristics = − ...

  • Page 53

    ... NXP Semiconductors 10. Static characteristics Table 8. Static characteristics = −40 °C to +85 °C for commercial applications, unless otherwise specified. T amb Symbol Parameter V supply voltage (3.3 V) DD(3V3) V DC-to-DC converter DD(DCDC)(3V3) supply voltage (3 analog 3.3 V pad DDA supply voltage V input voltage on pin i(VBAT) VBAT ...

  • Page 54

    ... NXP Semiconductors Table 8. Static characteristics = −40 °C to +85 °C for commercial applications, unless otherwise specified. T amb Symbol Parameter Standard port pins, RESET, RTCK I LOW-level input IL current I HIGH-level input IH current I OFF-state output OZ current I I/O latch-up current latch V input voltage I V output voltage ...

  • Page 55

    ... NXP Semiconductors Table 8. Static characteristics = −40 °C to +85 °C for commercial applications, unless otherwise specified. T amb Symbol Parameter Oscillator pins V input voltage on pin i(XTAL1) XTAL1 V output voltage on pin o(XTAL2) XTAL2 V input voltage on pin i(RTCX1) RTCX1 V output voltage on pin o(RTCX2) RTCX2 USB pins ...

  • Page 56

    ... NXP Semiconductors 10.1 Power-down mode I DD(IO) (μA) Fig 5. I (μA) Fig 6. LPC2478 Product data sheet −2 −4 −40 − 3 i(VBAT) DD(DCDC)(3V3) amb I/O maximum supply current I 40 BAT 3.3 V i(VBAT 3.0 V i(VBAT −40 − 3 DD(3V3) DD(DCDC)(3V3) RTC battery maximum supply current I mode All information provided in this document is subject to legal disclaimers ...

  • Page 57

    ... NXP Semiconductors I DD(DCDC)pd(3v3) Fig 7. 10.2 Deep power-down mode I DD(IO) (μA) Fig 8. LPC2478 Product data sheet 800 (μA) 600 400 V = 3.3 V DD(DCDC)(3V3) 200 V = 3.0 V DD(DCDC)(3V3) 0 −40 − ° 3 DD(3V3) i(VBAT) amb Total DC-to-DC converter supply current I in Power-down mode 300 ...

  • Page 58

    ... NXP Semiconductors I (μA) Fig 9. I DD(DCDC)dpd(3v3) Fig 10. Total DC-to-DC converter maximum supply current I LPC2478 Product data sheet 40 BAT 3.3 V i(VBAT 3.0 V i(VBAT −40 − 3 DD(3V3) DD(DCDC)(3V3) RTC battery maximum supply current I power-down mode 100 (μ 3.3 V DD(DCDC)(3V3 3.0 V DD(DCDC)(3V3) ...

  • Page 59

    ... NXP Semiconductors 10.3 Electrical pin characteristics V Fig 11. Typical HIGH-level output voltage V (mA) Fig 12. Typical LOW-level output current I LPC2478 Product data sheet 3 °C 25 °C 3.2 −40 °C 2.8 2.4 2 Conditions 3.3 V; standard port pins. DD(3V3 0.2 Conditions 3.3 V; standard port pins. ...

  • Page 60

    ... NXP Semiconductors 11. Dynamic characteristics Table 9. Dynamic characteristics = −40 °C to +85 °C for commercial applications amb Symbol Parameter External clock f oscillator frequency osc T clock cycle time cy(clk) t clock HIGH time CHCX t clock LOW time CLCX t clock rise time CLCH t clock fall time ...

  • Page 61

    ... NXP Semiconductors 11.1 Internal oscillators Table 10. Dynamic characteristic: internal oscillators = −40 °C to +85 °C; 3.0 V ≤ amb Symbol Parameter f internal RC oscillator frequency osc(RC) f RTC input frequency i(RTC) [1] Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. ...

  • Page 62

    ... NXP Semiconductors 11.4 Flash memory Table 13. Dynamic characteristics of flash = −40 °C to +85 °C, unless otherwise specified amb ground. Symbol Parameter N endurance endu t retention time ret [1] Number of program/erase cycles. [2] t specified for < 1 ppm. ret LPC2478 Product data sheet = 3 3.6 V; all voltages are measured with respect to ...

  • Page 63

    Static external memory interface Table 14. Dynamic characteristics: Static external memory interface = −40 ° ° pF amb DD(DCDC)(3V3) Symbol Parameter Conditions [1] Common to read and write cycles t CS ...

  • Page 64

    Table 14. Dynamic characteristics: Static external memory interface = −40 ° ° pF amb DD(DCDC)(3V3) Symbol Parameter Conditions t WE HIGH to data invalid WEHDNV time t BLS HIGH to address BLSHANV ...

  • Page 65

    ... NXP Semiconductors 11.6 Dynamic external memory interface Table 15. Dynamic characteristics: Dynamic external memory interface = −40 ° ° pF amb Config Register = 0x0 (RD = 00) Symbol Parameter Common t chip select valid delay time d(SV) t chip select hold time h(S) t row address strobe valid delay time ...

  • Page 66

    ... NXP Semiconductors 11.7 Timing CS addr data t CSLOEL OE BLS Fig 14. External memory read access CS BLS/WE addr data OE Fig 15. External memory write access LPC2478 Product data sheet t CSLAV OELAV t OELOEH t BLSLAV t CSLAV t WELWEH t CSLWEL t BLSLBLSH t t CSLBLSL WELDV t CSLDV All information provided in this document is subject to legal disclaimers. ...

  • Page 67

    ... NXP Semiconductors T PERIOD differential data lines Fig 16. Differential data-to-EOP transition skew and EOP width shifting edges SCK MOSI MISO Fig 17. MISO line set-up time in SSP Master mode Fig 18. Signal timing LPC2478 Product data sheet crossover point crossover point differential data to SE0/EOP skew n × ...

  • Page 68

    ... NXP Semiconductors 12. ADC electrical characteristics Table 16. ADC static characteristics = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz 2 3 DDA amb Symbol Parameter V analog input voltage IA C analog input capacitance ia E differential linearity error D E integral non-linearity L(adj) E offset error ...

  • Page 69

    ... NXP Semiconductors 1023 1022 1021 1020 1019 1018 7 code out offset error E O (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (E (4) Integral non-linearity (E L(adj) (5) Center of a step of the actual transfer curve. Fig 19. ADC characteristics LPC2478 Product data sheet ...

  • Page 70

    ... NXP Semiconductors AD0[y] Fig 20. Suggested ADC interface - LPC2478 AD0[y] pin LPC2478 Product data sheet LPC2XXX 20 kΩ SAMPLE SSIO, SSCORE All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 September 2010 LPC2478 Single-chip 16-bit/32-bit microcontroller R vsi AD0[y] V EXT 002aad586 © NXP B.V. 2010. All rights reserved. ...

  • Page 71

    ... NXP Semiconductors 13. DAC electrical characteristics Table 17. DAC electrical characteristics = −40 °C to +85 °C unless otherwise specified DDA amb Symbol Parameter E differential linearity error D E integral non-linearity L(adj) E offset error O E gain error G C load capacitance L R load resistance L LPC2478 Product data sheet Conditions All information provided in this document is subject to legal disclaimers ...

  • Page 72

    ... NXP Semiconductors 14. Application information 14.1 LCD panel signal usage Table 18. LCD panel connections for STN single panel mode External pin 4-bit mono STN single panel LPC2478 pin used LCDVD[23] - LCDVD[22] - LCDVD[21] - LCDVD[20] - LCDVD[19] - LCDVD[18] - LCDVD[17] - LCDVD[16] - LCDVD[15] - LCDVD[14] - LCDVD[13] - LCDVD[12] - LCDVD[11] ...

  • Page 73

    ... NXP Semiconductors Table 19. LCD panel connections for STN dual panel mode External pin 4-bit mono STN dual panel LPC2478 pin used LCDVD[23] - LCDVD[22] - LCDVD[21] - LCDVD[20] - LCDVD[19] - LCDVD[18] - LCDVD[17] - LCDVD[16] - LCDVD[15] - LCDVD[14] - LCDVD[13] - LCDVD[12] [3] LCDVD[11] P4[29] [3] LCDVD[10] P4[28] [2] LCDVD[9] P2[13] [2] LCDVD[8] P2[12] ...

  • Page 74

    ... NXP Semiconductors Table 20. LCD panel connections for TFT panels External TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) pin LPC2478 LCD pin used function [4] LCDVD[23] P1[29] BLUE3 [4] LCDVD[22] P1[28] BLUE2 [4] LCDVD[21] P1[27] BLUE1 [4] LCDVD[20] P1[26] BLUE0 LCDVD[19 LCDVD[18 LCDVD[17 LCDVD[16 [4] LCDVD[15] P1[25] ...

  • Page 75

    ... NXP Semiconductors 14.2 Suggested USB interface solutions LPC24XX Fig 21. LPC2478 USB interface on a self-powered device LPC24XX Fig 22. LPC2478 USB interface on a bus-powered device LPC2478 Product data sheet V DD(3V3) USB_UP_LED USB_CONNECT soft-connect switch R1 1.5 kΩ V BUS Ω USB_D Ω USB_D− SSIO, ...

  • Page 76

    ... NXP Semiconductors RSTOUT USB_SCL1 USB_SDA1 USB_INT1 USB_D+1 USB_D−1 USB_UP_LED1 LPC24XX USB_PPWR2 USB_OVRCR2 USB_PWRD2 USB_D+2 USB_D−2 USB_UP_LED2 Fig 23. LPC2478 USB OTG port configuration: USB port 1 OTG dual-role device, USB port 2 host LPC2478 Product data sheet RESET_N ADR/PSW OE_N/INT_N V DD SPEED ...

  • Page 77

    ... NXP Semiconductors RSTOUT USB_TX_E1 USB_TX_DP1 USB_TX_DM1 USB_RCV1 USB_RX_DP1 USB_RX_DM1 LPC24XX USB_SCL1 USB_SDA1 USB_INT1 USB_UP_LED1 Fig 24. LPC2478 USB OTG port configuration: VP_VM mode LPC2478 Product data sheet V DD RESET_N OE_N/INT_N DAT_VP SE0_VM RCV ISP1302 ADR/PSW SPEED SUSPEND SCL SDA INT_N V DD All information provided in this document is subject to legal disclaimers. ...

  • Page 78

    ... NXP Semiconductors USB_UP_LED1 USB_D+1 USB_D−1 USB_PWRD1 USB_OVRCR1 USB_PPWR1 LPC24XX USB_UP_LED2 USB_CONNECT2 USB_D+2 USB_D−2 V BUS Fig 25. LPC2478 USB OTG port configuration: USB port 2 device, USB port 1 host LPC2478 Product data sheet Ω 33 Ω 15 kΩ 15 kΩ ENA 5 V LM3526-L ...

  • Page 79

    ... NXP Semiconductors USB_UP_LED1 USB_D+1 USB_D−1 USB_PWRD1 USB_OVRCR1 USB_PPWR1 LPC24XX USB_PPWR2 USB_OVRCR2 USB_PWRD2 USB_D+2 USB_D−2 USB_UP_LED2 Fig 26. LPC2478 USB OTG port configuration: USB port 1 host, USB port 2 host 14.3 Crystal oscillator XTAL input and component selection The input voltage to the on-chip oscillators is limited to 1 the oscillator is driven by a ...

  • Page 80

    ... NXP Semiconductors In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTALOUT pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in ...

  • Page 81

    ... NXP Semiconductors Table 22. Fundamental oscillation frequency F 15 MHz to 20 MHz 20 MHz to 25 MHz 14.4 RTC 32 kHz oscillator component selection Fig 29. RTC oscillator modes and models: oscillation mode of operation and external The RTC external oscillator circuit is shown in integrated on chip, only a crystal, the capacitances C externally to the microcontroller ...

  • Page 82

    ... NXP Semiconductors 14.5 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors C third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain ...

  • Page 83

    ... NXP Semiconductors 14.7 Reset pin configuration Fig 31. Reset pin configuration LPC2478 Product data sheet reset GLITCH FILTER All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 September 2010 LPC2478 Single-chip 16-bit/32-bit microcontroller ESD ESD V SS 002aaf274 © NXP B.V. 2010. All rights reserved. ...

  • Page 84

    ... NXP Semiconductors 15. Package outline LQFP208; plastic low profile quad flat package; 208 leads; body 1 156 157 pin 1 index 208 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 1.45 mm 1.6 0.25 0.05 1.35 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...

  • Page 85

    ... NXP Semiconductors TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 0.7 mm ball A1 index area ball index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.4 0.8 0.5 mm 1.2 0.3 0.6 0.4 OUTLINE VERSION IEC SOT950-1 Fig 33. Package outline SOT950-1 (TFBGA208) ...

  • Page 86

    ... NXP Semiconductors 16. Abbreviations Table 24. Acronym ADC AHB AMBA APB BLS BOD CAN DAC DCC DMA EOP ETM GP GPIO IrDA JTAG LCD MCI MII MIIM OHC OHCI OTG PHY PLL PWM RMII SD SD/MMC SE0 SPI SSI SSP TTL UART USB LPC2478 Product data sheet ...

  • Page 87

    ... NXP Semiconductors 17. Revision history Table 25. Revision history Document ID Release date LPC2478 v.2 20100929 • Table 4 “Pin • Table 4 “Pin • Table 4 “Pin pins. • Table 4 “Pin • Table 6 “Limiting • Table 8 “Static • Table 8 “Static • Table 8 “Static • Table 8 “Static I • ...

  • Page 88

    ... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

  • Page 89

    ... For sales office addresses, please send an email to: LPC2478 Product data sheet own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

  • Page 90

    ... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 6 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Functional description . . . . . . . . . . . . . . . . . . 27 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 27 7.2 On-chip flash programming memory . . . . . . . 28 7.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 28 7 ...

  • Page 91

    ... NXP Semiconductors 11.3 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 61 11.4 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . 62 11.5 Static external memory interface . . . . . . . . . . 63 11.6 Dynamic external memory interface . . . . . . . . 65 11.7 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 12 ADC electrical characteristics . . . . . . . . . . . . 68 13 DAC electrical characteristics . . . . . . . . . . . . 71 14 Application information 14.1 LCD panel signal usage . . . . . . . . . . . . . . . . . 72 14.2 Suggested USB interface solutions . . . . . . . . 75 14 ...