MC9S12C32CFUE16 Freescale Semiconductor, MC9S12C32CFUE16 Datasheet - Page 167

IC MCU 32K FLASH 16MHZ 80-QFP

MC9S12C32CFUE16

Manufacturer Part Number
MC9S12C32CFUE16
Description
IC MCU 32K FLASH 16MHZ 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r

Specifications of MC9S12C32CFUE16

Core Processor
HCS12
Core Size
16-Bit
Speed
16MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
60
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
S12C
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
2 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
60
Number Of Timers
8
Operating Supply Voltage
- 0.3 V to + 6.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68EVB912C32EE
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
For Use With
CML12C32SLK - KIT STUDENT LEARNING 16BIT HCS12
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12C32CFUE16
Manufacturer:
FREESCALE
Quantity:
4 600
Part Number:
MC9S12C32CFUE16
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12C32CFUE16
Manufacturer:
FREESCALE
Quantity:
4 600
6.2
A single-wire interface pin is used to communicate with the BDM system. Two additional pins are used
for instruction tagging. These pins are part of the multiplexed external bus interface (MEBI) sub-block and
all interfacing between the MEBI and BDM is done within the core interface boundary. Functional
descriptions of the pins are provided below for completeness.
6.2.1
Debugging control logic communicates with external devices serially via the single-wire background
interface pin (BKGD). During reset, this pin is a mode select input which selects between normal and
special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the
background debug mode.
6.2.2
This pin is used to tag the high byte of an instruction. When instruction tagging is on, a logic 0 at the falling
edge of the external clock (ECLK) tags the high half of the instruction word being read into the instruction
queue.
6.2.3
This pin is used to tag the low byte of an instruction. When instruction tagging is on and low strobe is
enabled, a logic 0 at the falling edge of the external clock (ECLK) tags the low half of the instruction word
being read into the instruction queue.
Freescale Semiconductor
BKGD — Background interface pin
TAGHI — High byte instruction tagging pin
TAGLO — Low byte instruction tagging pin
BKGD and TAGHI share the same pin.
TAGLO and LSTRB share the same pin.
External Signal Description
BKGD — Background Interface Pin
TAGHI — High Byte Instruction Tagging Pin
TAGLO — Low Byte Instruction Tagging Pin
Generally these pins are shared as described, but it is best to check the
device overview chapter to make certain. All MCUs at the time of this
writing have followed this pin sharing scheme.
MC9S12C-Family / MC9S12GC-Family
Rev 01.24
NOTE
Chapter 6 Background Debug Module (BDMV4) Block Description
167

Related parts for MC9S12C32CFUE16