MCIMX512DJM8C Freescale Semiconductor, MCIMX512DJM8C Datasheet - Page 18

• Manufacturer Part Number: MCIMX512DJM8C
• Description: MULTIMEDIA PROC 529-LFBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX51r

Specifications of MCIMX512DJM8C

• Core Processor: ARM Cortex-A8
• Core Size: 32-Bit
• Speed: 800MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: ROMless
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 0.8 V ~ 1.15 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 529-LFBGA
• Processor Series: i.MX51
• Core: ARM Cortex A8
• Data Bus Width: 32 bit
• Program Memory Size: 36 KB
• Data Ram Size: 128 KB
• Interface Type: I2C, SPI, SSI, UART, USB
• Maximum Clock Frequency: 200 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 0.8 V to 1.15 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: MCIMX51EVKJ
• Minimum Operating Temperature: - 20 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1
Electrical Characteristics
Table 12
18
1
Peripheral Core Supply Voltage
ARM Core Supply Voltage
Supply Voltage (UHVIO, I
Supply Voltage (except UHVIO, I
USB VBUS
Input/Output Voltage Range
ESD Damage Immunity:
Storage Temperature Range
Junction Temperature (MCIMX51xD—Consumer)
Junction Temperature (MCIMX51xC—Industrial)
Junction to Case
Junction to Case
The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in
Table 128
Rjc-x per JEDEC 51-12: The junction-to-case thermal resistance. The “x” indicates the case surface where T
and through which 100% of the junction power is forced to flow due to the cold plate heat sink fixture placed either at the top (T)
or bottom (B) of the package, with no board attached to the package.
provides the thermal resistance data.
and
Parameter Description
Table
1
1
, 19 x 19 mm package
, 13 x 13 mm package
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
Charge Device Model (CDM)
131. The maximum range can be superseded by the DC tables.
Human Body Model (HBM)
Rating
2
C)
2
C)
Table 11. Absolute Maximum Ratings
Table 12. Thermal Resistance Data
Supplies denoted as I/O Supply
Supplies denoted as I/O Supply
T
Board
Symbol
VDDGP
V
STORAGE
VBUS
VCC
in
V
—
—
T
T
/V
esd
J
J
out
Symbol
R
R
θJC
θJC
–0.3
–0.3
–0.5
–0.5
–0.5
Min
–40
—
—
—
—
—
Value
Freescale Semiconductor
OVDD + 0.3
6
6
2000
Max
1.35
1.15
5.25
500
125
105
105
3.6
3.3
case
is measured
1
°C/W
°C/W
Unit
Unit
o
o
o
V
V
V
V
V
V
V
C
C
C