MC9S08AC16CFGE Freescale Semiconductor, MC9S08AC16CFGE Datasheet - Page 35

IC MCU 8BIT 16K FLASH 44-LQFP

MC9S08AC16CFGE

Manufacturer Part Number
MC9S08AC16CFGE
Description
IC MCU 8BIT 16K FLASH 44-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08AC16CFGE

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
34
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-LQFP
Package
44LQFP
Family Name
HCS08
Maximum Speed
40 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
34
Interface Type
I2C/SCI/SPI
On-chip Adc
8-chx10-bit
Number Of Timers
8
Processor Series
S08AC
Core
HCS08
Data Ram Size
1 KB
Maximum Clock Frequency
40 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
Minimum Operating Temperature
- 40 C
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Total Internal Ram Size
1KB
# I/os (max)
34
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Chapter 3
Modes of Operation
3.1
The operating modes of the MC9S08AC16 Series are described in this chapter. Entry into each mode, exit
from each mode, and functionality while in each of the modes are described.
3.2
3.3
This is the normal operating mode for the MC9S08AC16 Series. This mode is selected when the
BKGD/MS pin is high at the rising edge of reset. In this mode, the CPU executes code from internal
memory with execution beginning at the address fetched from memory at 0xFFFE:0xFFFF after reset.
3.4
The active background mode functions are managed through the background debug controller (BDC) in
the HCS08 core. The BDC, together with the on-chip debug module (DBG), provide the means for
analyzing MCU operation during software development.
Active background mode is entered in any of five ways:
Freescale Semiconductor
Active background mode for code development
Wait mode:
— CPU shuts down to conserve power
— System clocks running
— Full voltage regulation maintained
Stop modes:
— System clocks stopped; voltage regulator in standby
— Stop2 — Partial power down of internal circuits, RAM contents retained
— Stop3 — All internal circuits powered for fast recovery
When the BKGD/MS pin is low at the rising edge of reset
When a BACKGROUND command is received through the BKGD pin
When a BGND instruction is executed
When encountering a BDC breakpoint
When encountering a DBG breakpoint
Introduction
Features
Run Mode
Active Background Mode
MC9S08AC16 Series Data Sheet, Rev. 8
35

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