MC9S12C64CFUE Freescale Semiconductor, MC9S12C64CFUE Datasheet - Page 185

IC MCU 64K FLASH 4K RAM 80-QFP

MC9S12C64CFUE

Manufacturer Part Number
MC9S12C64CFUE
Description
IC MCU 64K FLASH 4K RAM 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12C64CFUE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
60
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
S12C
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
60
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68EVB912C32EE
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
80PQFP
Family Name
HCS12
Maximum Speed
25 MHz
Operating Supply Voltage
2.5|5 V
Height
2.4 mm
Length
14 mm
Supply Voltage (max)
2.75 V, 5.5 V
Supply Voltage (min)
2.35 V, 2.97 V
Width
14 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12C64CFUE
Manufacturer:
FREESCALE
Quantity:
3 450
Part Number:
MC9S12C64CFUE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12C64CFUE
Manufacturer:
FREESCALE
Quantity:
3 450
Figure 6-13
occur if a POD device is connected to the target BKGD pin and the target is already in debug active mode.
Consider that the target CPU is executing a pending BDM command at the exact moment the POD is being
connected to the BKGD pin. In this case, an ACK pulse is issued along with the SYNC command. In this
case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. Because this is
not a probable situation, the protocol does not prevent this conflict from happening.
The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE
BDM commands. This provides backwards compatibility with the existing POD devices which are not
able to execute the hardware handshake protocol. It also allows for new POD devices, that support the
hardware handshake protocol, to freely communicate with the target device. If desired, without the need
for waiting for the ACK pulse.
Freescale Semiconductor
(TARGET MCU)
BKGD PIN
DRIVES SYNC
TARGET MCU
TO BKGD PIN
BDM CLOCK
DRIVES TO
BKGD PIN
BKGD PIN
HOST
shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could
This information is being provided so that the MCU integrator will be aware
that such a conflict could eventually occur.
READ_BYTE
HOST
AND STARTS TO EXECUTES
Figure 6-12. ACK Abort Procedure at the Command Level
READ_BYTE CMD IS ABORTED
Figure 6-13. ACK Pulse and SYNC Request Conflict
THE READ_BYTE CMD
MEMORY ADDRESS
TARGET
BY THE SYNC REQUEST
HOST SYNC REQUEST PULSE
BDM DECODE
ACK PULSE
16 CYCLES
(OUT OF SCALE)
MC9S12C-Family / MC9S12GC-Family
HOST AND
TARGET DRIVE
TO BKGD PIN
AT LEAST 128 CYCLES
Rev 01.24
NOTE
Chapter 6 Background Debug Module (BDMV4) Block Description
ELECTRICAL CONFLICT
HIGH-IMPEDANCE
HOST
SYNC RESPONSE
FROM THE TARGET
(OUT OF SCALE)
READ_STATUS
TARGET
NEW BDM COMMAND
NEW BDM COMMAND
HOST
SPEEDUP PULSE
TARGET
185

Related parts for MC9S12C64CFUE