UPD70F3736GK-GAK-AX Renesas Electronics America, UPD70F3736GK-GAK-AX Datasheet - Page 52

• Manufacturer Part Number: UPD70F3736GK-GAK-AX
• Description: MCU 32BIT V850ES/JX3-L 80-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3736GK-GAK-AX

• Package / Case: *
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Speed: 20MHz
• Number Of I /o: 66
• Core Processor: RISC
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Program Memory Size: 256KB (256K x 8)
• Data Converters: A/D 8x10b, D/A 1x8b
• Oscillator Type: Internal
• Peripherals: DMA, LVD, PWM, WDT
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Core Size: 32-Bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

3.4.3
52
The areas shown below are reserved in the V850ES/JF3-L.
Notes 1. The V850ES/JF3-L has 18 address pins, so the external memory area appears as a repeated 256 KB
0 3 F F F F F F H
0 3 F F 0 0 0 0 H
0 3 F E F F F F H
0 1 0 0 0 0 0 0 H
0 0 F F F F F F H
0 0 2 0 0 0 0 0 H
0 0 1 F F F F F H
0 0 0 0 0 0 0 0 H
Memory map
2. Fetch access and read access to addresses 00000000H to 000FFFFFH is made to the internal ROM
image.
area. However, data write access to these addresses is made to the external memory area.
External memory area
Use prohibited
(14 MB)
Figure 3-2. Data Memory Map (Physical Addresses)
(64 KB)
(2 MB)
Preliminary User’s Manual U18952EJ1V0UD
Note 1
CHAPTER 3 CPU FUNCTION
On-chip peripheral I/O area
External memory area
Internal ROM area
Internal RAM area
(60 KB)
(1 MB)
(1 MB)
(4 KB)
Note 2
Note 1
0 3 F F F F F F H
0 3 F F F 0 0 0 H
0 3 F F E F F F H
0 3 F F 0 0 0 0 H
0 0 1 F F F F F H
0 0 1 0 0 0 0 0 H
0 0 0 F F F F F H
0 0 0 0 0 0 0 0 H