MC9S12DG256BVPV Freescale Semiconductor, MC9S12DG256BVPV Datasheet - Page 13

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MC9S12DG256BVPV

Manufacturer Part Number
MC9S12DG256BVPV
Description
IC MCU 256K FLASH 25MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12DG256BVPV

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, I²C, SCI, SPI
Peripherals
PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.25 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12DG256BVPV
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12DG256BVPV
Manufacturer:
FREESCALE
Quantity:
20 000
List of Tables
Table 0-1
Table 0-2
Table 0-4
Table 0-3
Table 1-1
Table 1-2
Table 1-3
Table 1-4
Table 2-1
Table 2-2
Table 4-1
Table 4-2
Table 4-3
Table 5-1
Table 6-1
Table A-1
Table A-2
Table A-3
Table A-4
Table A-5
Table A-6
Table A-7
Table A-8
Table A-9
Table A-10 ATD Conversion Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
Table A-11 NVM Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102
Table A-12 NVM Reliability Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103
Table A-13 Voltage Regulator Recommended Load Capacitances . . . . . . . . . . . . . . . . . . .105
Table A-14 Startup Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107
Table A-15 Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .108
Table A-16 PLL Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
Table A-17 MSCAN Wake-up Pulse Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
Table A-18 SPI Master Mode Timing Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
Drivative Differences MC9S12D256B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Derivative Differences MC9S12D256C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Document References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Defects fixed on Maskset 2K79X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Assigned Part ID Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Memory size registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Signal Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
MC9S12DP256 Power and Ground Connection Summary . . . . . . . . . . . . . . . . . .69
Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Clock Selection Based on PE7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Voltage Regulator VREGEN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Interrupt Vector Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Configuration of HCS12 Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
ESD and Latch-up Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90
ESD and Latch-Up Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .90
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
Thermal Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93
5V I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .94
Supply Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
ATD Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
ATD Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98
Detailed MSCAN Foreground Receive and Transmit Buffer Layout. . . . . . . . . . .41
Freescale Semiconductor, Inc.
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MC9S12DP256B Device User Guide — V02.14
13

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