MC9S12DG256BVPV Freescale Semiconductor, MC9S12DG256BVPV Datasheet - Page 84

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MC9S12DG256BVPV

Manufacturer Part Number
MC9S12DG256BVPV
Description
IC MCU 256K FLASH 25MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12DG256BVPV

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, I²C, SCI, SPI
Peripherals
PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.25 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12DG256BVPV
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12DG256BVPV
Manufacturer:
FREESCALE
Quantity:
20 000
MC9S12DP256B Device User Guide — V02.14
84
Every supply pair must be decoupled by a ceramic capacitor connected as near as
possible to the corresponding pins(C1 - C6).
Central point of the ground star should be the VSSR pin.
Use low ohmic low inductance connections between VSS1, VSS2 and VSSR.
VSSPLL must be directly connected to VSSR.
Keep traces of VSSPLL, EXTAL and XTAL as short as possible and occupied board area
for C7, C8, C11 and Q1 as small as possible.
Do not place other signals or supplies underneath area occupied by C7, C8, C10 and Q1
and the connection area to the MCU.
Central power input should be fed in at the VDDA/VSSA pins.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com

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