MC9S12DG256BVPV Freescale Semiconductor, MC9S12DG256BVPV Datasheet - Page 93

• Manufacturer Part Number: MC9S12DG256BVPV
• Description: IC MCU 256K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12DG256BVPV

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
Num C
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
1
2
3
4
T Thermal Resistance LQFP112, single sided PCB
T
T Thermal Resistance LQFP 80, single sided PCB
T
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes
Thermal Resistance LQFP 80, double sided PCB
with 2 internal planes
Table A-5 Thermal Package Characteristics
3
Rating
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
2
Symbol
JA
JA
JA
JA
MC9S12DP256B Device User Guide — V02.14
Min
-
-
-
-
1
Typ
-
-
-
-
Max
54
41
51
41
o
o
o
o
Unit
C/W
C/W
C/W
C/W
93