MC9S12DG256BVPV Freescale Semiconductor, MC9S12DG256BVPV Datasheet - Page 92

• Manufacturer Part Number: MC9S12DG256BVPV
• Description: IC MCU 256K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12DG256BVPV

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

MC9S12DP256B Device User Guide — V02.14
The total power dissipation can be calculated from:
Two cases with internal voltage regulator enabled and disabled must be considered:
T
T
P
P INT
J
A
D
JA
1. Internal Voltage Regulator disabled
2. Internal voltage regulator enabled
92
P
For R
respectively
I
additionally contains the current flowing into the external loads with output high.
P
=
DDR
=
=
IO
IO
=
Junction Temperature, [ C
Ambient Temperature, [ C
=
Total Chip Power Dissipation, [W]
is the sum of all output currents on I/O ports associated with VDDX and VDDR.
is the sum of all output currents on I/O ports associated with VDDX and VDDR.
Package Thermal Resistance, [ C/W]
is the current shown in Table A-7 and not the overall current flowing into VDDR, which
DSON
Chip Internal Power Dissipation, [W]
is valid:
P
INT
R
DSON
=
Freescale Semiconductor, Inc.
I
P INT
R
DD
For More Information On This Product,
DSON
=
V
P
=
P
DD
V
----------------------------------- - for outputs driven high
T
IO
IO
Go to: www.freescale.com
I DDR V DDR
DD5
J
=
P
+
=
=
=
D
I
V
----------- - for outputs driven low
I
I
OH
DDPLL
OL
OL
T
–
=
i
i
A
V
P
;
R
R
OH
+
INT
DSON
DSON
P
;
D
V
+
+
DDPLL
P
I DDA V DDA
IO
JA
I
I
IO i
IO i
2
2
+
I
DDA
V
DDA