MCF54452VR266 Freescale Semiconductor, MCF54452VR266 Datasheet - Page 2

• Manufacturer Part Number: MCF54452VR266
• Description: IC MPU 32BIT 266MHZ 360TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF5445xr

Specifications of MCF54452VR266

• Core Processor: Coldfire V4
• Core Size: 32-Bit
• Speed: 266MHz
• Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, WDT
• Number Of I /o: 132
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 360-TEPBGA
• Family Name: MCF5445X
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 266MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 1.65/3.6V
• Operating Supply Voltage (min): 1.35/3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 360
• Package Type: TEBGA
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• For Use With: M54455EVB - BOARD EVAL FOR MCF5445X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

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2
3
4
5
2
MCF5445x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . .4
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .5
3.1
3.2
3.3
Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .7
4.1
4.2
4.3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
Analog Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . .5
Oscillator Power Filtering . . . . . . . . . . . . . . . . . . . . . . . .6
Supply Voltage Sequencing . . . . . . . . . . . . . . . . . . . . . .6
3.3.1 Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . .7
3.3.2 Power-Down Sequence . . . . . . . . . . . . . . . . . . . .7
Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Pinout—256 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .15
Pinout—360 TEPBGA. . . . . . . . . . . . . . . . . . . . . . . . . .16
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .17
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .18
ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .19
ClockTiming Specifications . . . . . . . . . . . . . . . . . . . . . .20
Reset Timing Specifications . . . . . . . . . . . . . . . . . . . . .22
FlexBus Timing Specifications . . . . . . . . . . . . . . . . . . .23
SDRAM AC Timing Characteristics. . . . . . . . . . . . . . . .25
PCI Bus Timing Specifications . . . . . . . . . . . . . . . . . . .27
MCF5445x ColdFire
Table of Contents
®
Microprocessor Data Sheet, Rev. 6
6
7
8
9
5.10 ULPI Timing Specifications . . . . . . . . . . . . . . . . . . . . . 29
5.11 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 30
5.12 I
5.13 Fast Ethernet Timing Specifications . . . . . . . . . . . . . . 33
5.14 32-Bit Timer Module Timing Specifications . . . . . . . . . 35
5.15 ATA Interface Timing Specifications. . . . . . . . . . . . . . . 36
5.16 DSPI Timing Specifications . . . . . . . . . . . . . . . . . . . . . 36
5.17 SBF Timing Specifications. . . . . . . . . . . . . . . . . . . . . . 38
5.18 General Purpose I/O Timing Specifications. . . . . . . . . 39
5.19 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 40
5.20 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . 42
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
5.9.1 Overshoot and Undershoot . . . . . . . . . . . . . . . 28
5.13.1 Receive Signal Timing Specifications . . . . . . . 33
5.13.2 Transmit Signal Timing Specifications . . . . . . . 34
5.13.3 Asynchronous Input Signal Timing
5.13.4 MII Serial Management Timing Specifications . 35
2
C Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 32
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Freescale Semiconductor